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The operation of opening the lid after solder paste is warmed up directly affects the stability of solder paste usage and printing yield. The specification requires that the warmed solder paste must be left to stand in a constant temperature room for more than 4 hours, with no condensed water on the surface, gently shaken and mixed before opening the lid, and the exposure time throughout the process must be controlled to no more than 8 hours. All links need to record the batch number, the start and end time of warming up, and the first lid opening time to ensure that the entire process of solder paste usage is traceable and reviewable.
Published: 2020-07-18
The Jiajinyuan technical team provides on-site resident services at the customer's SMT production line, conducting full-process diagnosis and process optimization for typical soldering defects such as solder bridging and tombstoning. Relying on precise selection and parameter matching of various halogen-free and lead-free high-temperature solder pastes including 8MQP/5RQ and 8MNTTP/5RNTT, combined with 030
Published: 2020-07-16First article inspection is the first gate for error prevention on the SMT production line. It is necessary to simultaneously verify the consistency between material models and the BOM, the thickness and offset of solder paste printing, the XYθ deviation of placement positions, and whether the temperature and time in each zone of the reflow profile meet the process window of JiajinYuan solder paste. Any inaccuracy in any link will cause irreversible defects such as cold solder joints, tombstoning, or cold soldering in mass production.
Published: 2020-07-12The solder for industrial control motherboards must maintain zero solder joint cracking under wide temperature range, high vibration and long-cycle operating conditions. Jiayuan's high-reliability halogen-free formula, by optimizing the SnAgCu alloy ratio and active flux system, keeps the IMC layer thickness stably at 3.2±0.4μm after 500 cycles of thermal shock from -40℃ to 85℃, completely avoids electromigration failure caused by halogen corrosion, and significantly improves the service life of industrial control motherboard solder in harsh scenarios such as rail transit and power monitoring.
Published: 2020-07-01In fine-pitch IC reflow soldering, the metal content, particle size distribution and flux activity of solder paste must match pad pitches below 0.4mm. Yield fluctuations exceeding 30% in reflow soldering often stem from uneven solder paste collapse or insufficient wetting after reflow. For Jiajinyuan JH-812A, the measured bridging rate on 0.35mm pitch QFN is below 0.12%. Its 25μm median particle size and 55% metal content work synergistically to suppress printing misalignment and reflow splattering.
Published: 2020-06-11
An intelligent vehicle is built on the basis of a conventional vehicle by adding devices such as sensors, controllers, and actuators, and realizes intelligent information exchange with people, other vehicles, and roads through an onboard sensing system and information terminals.
Published: 2020-06-09
After solder wire oxidizes, poor soldering wetting and frequent solder breakage during wire drawing occur. Production lines commonly use fine sandpaper for light grinding followed by wiping with anhydrous ethanol to quickly restore the active surface. Storing the solder wire in a constant-temperature moisture-proof cabinet can significantly delay the oxidation process.
Published: 2020-06-04This paper focuses on the practical application of sensor solders in the SMT process of electronic sensor PCBs, covering the solder selection logic for common sensors such as thermal sensors, pressure sensors, and acceleration sensors, key points for reflow profile adaptation, and production line-level troubleshooting paths for cold solder joints and missed solder joints. It emphasizes the differentiated performance of two sensor solders, Jiajinyuan SN100C and SN63Pb37, in terms of wettability, residue activity, and thermal shock resistance.
Published: 2020-05-08Standardized operations for solder paste replenishment and stirring in high-speed SMT printing production lines directly determine printing yield and equipment utilization. Based on the actual adaptability of Jiajinyuan solder paste at squeegee speeds above 300mm/s, this article details key control points such as replenishment frequency, temperature control window, and manual/automatic stirring parameter settings. All operations have been verified through 72 consecutive hours of production line testing.
Published: 2020-04-09To address whether solder paste can be reused after extended downtime on SMT production lines, this paper proposes criteria for determining the usability of downtime solder paste based on 20 years of measured production line data. It clarifies the critical points of solder paste activity decay under different temperature and humidity conditions, directly guiding on-site engineers to quickly decide whether the downtime solder paste can continue to be used or must be scrapped.
Published: 2020-04-09Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.