SMT Solder Paste Manufacturers.
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Against the backdrop of fluctuating raw material prices in 2022, multiple enterprises in the solder paste industry reduced production costs and increased product added value through technological improvements, demonstrating the resilience and innovation of the industry.
Published: 2022-12-30Running solder samples on machines at an electronics factory is a key action to verify the compatibility of new solder batches with existing SMT production lines. By running small-batch trial production in real environments with stencils, placement machines, and reflow ovens, adaptation issues such as poor printing release, placement offset, and reflow cold soldering can be quickly identified, avoiding rework after the entire batch of materials goes online. The batch stability, thixotropy, and activity of electronics factory solder must be cross-verified through actual production line testing.
Published: 2022-12-25
Jiajinyuan has launched a high-stability no-clean solder paste, specifically designed for 01005 micro components. By optimizing the alloy powder particle size distribution (T4/T5), rosin-based flux system, and rheological property control, it significantly improves printing anti-slump performance while maintaining halogen-free and lead-free high-temperature characteristics, meeting the high solder climbing rate requirements for QFN/DFN.
Published: 2022-12-14QFN soldering on new energy electronic control boards faces dual challenges of high-frequency vibration and thermal cycling. By optimizing stencil aperture design, reflow profile, and pad design, Jiajinyuan has increased the thrust of QFN solder joints to over 28N, with the IMC layer thickness controlled at 3.2μm±0.4μm, effectively suppressing microcrack propagation and meeting the long-term reliability requirements of automotive-grade IPX7 protection and operating conditions ranging from -40℃ to 125℃.
Published: 2022-12-11
The temperature control range of solder bars in wave soldering machines is typically 250°C to 265°C, which should be comprehensively adjusted based on the alloy composition of the solder bar, PCB thickness, component density, and flux activity. Excessively high wave soldering temperatures can easily cause copper foil peeling and thermal damage to components, while excessively low temperatures can lead to cold solder joints, solder spikes, and bridging. In actual production lines, dynamic fine-tuning must be performed by combining solder fluidity tests and solder joint cross-section analysis.
Published: 2022-11-29For soldering gold-plated boards, it is necessary to balance the thickness of the pad gold layer with the activity matching of the flux to avoid black pad, cold solder joints, and excessive IMC growth. Jia Jinyuan's gold-plated board soldering solution has achieved a soldering defect rate below 0.3% in aerospace modules and medical equipment, with the key lying in the collaborative implementation of solder paste selection, reflow profile gradient control, and an oxygen content ≤100ppm under a nitrogen atmosphere.
Published: 2022-11-255G device solder must meet the dual stringent requirements of high-frequency signal integrity and thermal cycle reliability. Jinyuan JNY-5G188 lead-free solder achieves zero void rate soldering in scenarios such as base station power amplifier modules and router RF motherboards. Its low-silver ratio and active flux synergistically optimize wetting speed and residue insulation.
Published: 2022-11-11Conduct actual measurements on small-batch samples of sensor soldering solder to verify its wetting and spreading performance and void rate control capability under the conditions of 0.3mm pitch micro-pads and gold-plated nickel-palladium-gold surface treatment, with a focus on examining the bridging suppression effect and IMC layer uniformity of Jiajinyuan JH-851A lead-free solder at a peak temperature of 235℃ under a nitrogen atmosphere.
Published: 2022-10-29As a high-frequency industrial by-product generated in SMT production lines, solder dross typically has a tin content of 60% to 75%. Through Jia Jinyuan's dedicated centrifugal separation and low-temperature smelting processes, over 92% of metallic tin can be stably recovered and directly reused in solder paste formulation or wave soldering bath replenishment, reducing the factory's overall tin material loss rate from the traditional 3.8% to within 1.2%.
Published: 2022-10-16The stability control of batch viscosity and alloy fluctuation of solder paste focuses on the root causes of solder paste quality fluctuations in actual production lines. By real-time monitoring of viscosity changes and alloy composition deviations of batch solder paste, combined with dynamic calibration of printing parameters, it effectively suppresses defects such as insufficient solder, solder bridging, and solder collapse caused by batch differences in solder paste, and practically improves the SMT first-pass yield and long-term process capability.
Published: 2022-10-11Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.