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Cold solder joints with rough surfaces, poor mechanical strength, and susceptibility to fracture failure are a high-frequency failure mode in SMT production lines. The root causes are insufficient melting of the solder paste, inadequate flux activity, or low reflow peak temperature. For Jia Jinyuan solder paste on 0.3mm fine-pitch QFN devices, if the reflow peak temperature is below 217°C, batch cold soldering leading to weak solder joints with thrust below 8gf is highly likely to occur.
Published: 2018-01-01To address the common issues of solder paste residue, ionic contamination, and incomplete cleaning encountered by water-washable solder paste in SMT production lines, this paper draws on 20 years of on-site commissioning experience to systematically outline key control points, including the matching of squeegee pressure and speed, the synergy of cleaning agent concentration and temperature, and the centrifugal speed and time window. It emphasizes that solder paste residue must be verified through dual validation of conductivity testing and microscopic re-inspection, to avoid batch rework caused by relying solely on cleaning machine parameters.
Published: 2017-12-24
A break in the rosin core of solder wire causes interrupted flux supply, poor wetting, and frequent cold solder joints during soldering. In actual production lines, this often manifests as dull solder joints, sharp spikes, and increased spattering, with problems becoming especially apparent during continuous wire feeding or manual touch-up soldering. Deviations in the concentricity between the solder wire and its rosin core, as well as fluctuations in the wire drawing process, are the root causes.
Published: 2017-12-21Selective wave soldering significantly reduces changeover time and fixture debugging frequency by precisely positioning soldering areas and skipping already surface-mounted components. In multi-variety, small-batch PCBA production, it compresses the preparation cycle per batch to within 15 minutes, greatly improving overall equipment effectiveness, and serves as the core process support for Jiajinyuan models to achieve high output in small and medium batch order scenarios.
Published: 2017-12-09Addressing the practical selection pain points of SMT production lines, this section breaks down the solder paste selection logic from three dimensions: printability, reflow performance, and cleaning compatibility. It clarifies that water-washable solder paste must match the spray pressure and solvent concentration of the cleaning machine, while no-clean solder paste must pass the ionic contamination test and its residues must not corrode gold fingers. The performance differences of different solder pastes under stencil aperture, squeegee angle, and ambient temperature and humidity directly determine the first-pass yield.
Published: 2017-10-15In the tin dipping process, the tin dipping time is a key parameter determining the thickness of the terminal tin layer. Excessively long dipping time will lead to an overly thick tin layer, which is prone to oxidation, poor soldering, and abnormal insertion/extraction force. Actual measurements on Jia Jinyuan's production line show that for every 0.5-second increase in tin dipping time, the average tin thickness increases by 8–12 μm. Comprehensive control must be implemented in combination with the base material, tin bath temperature, and flux activity.
Published: 2017-10-14
Although flux paste and solder paste both contain flux components, they are fundamentally different. Flux paste contains no metal powder and is specifically used for local touch-up soldering or BGA rework, while solder paste is made by mixing tin powder with flux paste and is suitable for SMT fully automatic printing and placement. The two have non-interchangeable process differences in viscosity, metal content, reflow characteristics and equipment compatibility.
Published: 2017-10-04The scientific combination of soldering auxiliary materials with solder paste and solder wire can significantly improve the first-pass yield of soldering. Especially in difficult processes such as 0201 component placement, QFN bottom pad filling, and OSP board surface wetting, Jiayuanjin solder paste paired with soldering auxiliary materials of corresponding activity levels can reduce the probability of cold soldering, solder bridging, and tombstoning, while reducing cleaning residue and ion contamination risks.
Published: 2017-09-21In the entire chip soldering process, the precision of solder paste printing via SMT stencil directly determines the yield of subsequent component placement and reflow soldering. The viscosity, particle size, and metal content of the solder paste, as well as printing parameters such as squeegee pressure, speed, and release distance, must be coordinated and matched with the actual conditions of the production line. Any mismatch will cause typical defects such as insufficient solder, solder bridging, and misalignment.
Published: 2017-09-07
Yellowing and deterioration of solder paste is a common yet easily misjudged issue on SMT production lines, and its essence is mostly related to rosin oxidation, solvent volatilization, or metal ion-catalyzed reactions. Improper storage of solder paste will accelerate this process. Yellowing does not necessarily mean complete failure, but whether to continue using it requires comprehensive judgment by combining measured indicators such as viscosity changes, solder ball residue, and wetting force attenuation.
Published: 2017-08-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.