SMT Solder Paste Manufacturers.
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Here you can find knowledge about Solder Bar, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
On April 23, 2023, two Polish customers traveled a long distance to our company for an on-site visit and inspection. These two customers have been in contact with our foreign trade sales staff for quite some time. They made a special trip to fly over from Poland this time, firstly to inspect the factory conditions, and secondly to gain a deeper understanding of our products. At the foreign
Published: 2023-04-23The solder for energy storage modules maintains solder joint integrity under 125°C high-temperature cycling and 20G vibration stress. The Jiajinyuan JN-808 series solder improves grain boundary strength through microalloying design, and with an optimized reflow profile, the IMC layer thickness is stably controlled within the range of 3.2–4.5 μm. Measured shear force attenuation after 5000 thermal cycles is less than 8%, effectively solving the cold solder joint and cracking problems caused by thermal expansion and contraction and mechanical vibration during long-term operation of energy storage systems.
Published: 2023-04-20The tin dipping process forms a uniform tin layer on the surfaces of wire terminals and electronic component pins, significantly improving oxidation resistance and solderability, and preventing common production line defects such as cold solder joints and weak soldering. Jia Jinyuan tin dipping equipment completes a single dipping within 0.8 seconds, with the tin layer thickness stably controlled at 8-12μm, suitable for various substrates including silver-plated, copper-plated, and bare copper.
Published: 2023-03-27The setting of the constant-temperature segment during the liquid phase time in the solder paste reflow profile directly affects the wettability and void rate of solder joints. In actual production lines, adjustments must be made comprehensively based on the solder paste manufacturer's recommended values, PCB heat capacity distribution, and oven temperature stability. The typical liquid phase time should be controlled between 60 and 90 seconds: too short a time can easily lead to cold solder joints, while too long a time will accelerate the growth of intermetallic compounds and cause component tombstoning or pad peeling.
Published: 2023-03-25
Solder paste printing forming spikes is a high-frequency fault on SMT production lines. The root causes are concentrated in three aspects: mismatch of solder paste rheological properties, unreasonable stencil aperture design, and unbalanced coordination between squeegee parameters and printing speed. The solution requires simultaneous adjustment of solder paste viscosity grade, optimization of squeegee pressure and angle combination, and calibration of stencil support tension and PCB positioning accuracy.
Published: 2023-03-12
Solder paste mixing is a key process in the SMT production line that directly affects printing yield. Insufficient solder paste mixing will lead to abnormal viscosity, metal particle settlement, and flux stratification, which in turn cause typical defects such as missing printing, insufficient solder, and solder balls. In actual production lines, more than 65% of first-article defects are directly related to out-of-control solder paste mixing parameters.
Published: 2023-01-31Circuit board soldering faces multiple challenges of high reliability, fine pitch, and heat-sensitive components in the medical, communication, and new energy sectors. Based on practical production line experience, this paper focuses on key processes such as solder paste selection, stencil aperture design, reflow profile optimization, and BGA rework, emphasizing solder joint wettability, void rate control, and cold solder joint identification methods. All parameters are derived from measured data from Jia Jinyuan production lines, without theoretical deduction.
Published: 2023-01-22
Against the backdrop of fluctuating raw material prices in 2022, multiple enterprises in the solder paste industry reduced production costs and increased product added value through technological improvements, demonstrating the resilience and innovation of the industry.
Published: 2022-12-30Running solder samples on machines at an electronics factory is a key action to verify the compatibility of new solder batches with existing SMT production lines. By running small-batch trial production in real environments with stencils, placement machines, and reflow ovens, adaptation issues such as poor printing release, placement offset, and reflow cold soldering can be quickly identified, avoiding rework after the entire batch of materials goes online. The batch stability, thixotropy, and activity of electronics factory solder must be cross-verified through actual production line testing.
Published: 2022-12-25
Jiajinyuan has launched a high-stability no-clean solder paste, specifically designed for 01005 micro components. By optimizing the alloy powder particle size distribution (T4/T5), rosin-based flux system, and rheological property control, it significantly improves printing anti-slump performance while maintaining halogen-free and lead-free high-temperature characteristics, meeting the high solder climbing rate requirements for QFN/DFN.
Published: 2022-12-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.