SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Solder Ball Reduction, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The duration of the constant temperature zone directly affects the synergistic effect of flux activity release and solder joint wetting and spreading in reflow solder paste. If it is too short, it will easily lead to an increase in the void rate of solder paste joints and poor wetting; if it is too long, it will cause excessive growth of intermetallic compounds and thermal damage to components. The actual production line needs to be comprehensively adjusted in combination with the solder paste model, PCB heat capacity distribution, and furnace temperature belt speed.
Published: 2014-08-25Wave soldering of thick-copper PCBs is prone to solder joint voids, poor wetting, and uneven heat absorption caused by copper thickness. Using Jiajinyuan high-wettability solder bars can significantly improve solder climb height and the consistency of fillet formation, with particularly pronounced process advantages in structures with copper thickness above 2oz, large-area copper foils, and multilayer thick-copper constructions.
Published: 2014-08-25Solder paste thermal cycling testing is a key method for evaluating the fatigue resistance of solder paste joints under repeated temperature changes. By simulating the alternating hot and cold processes in the actual service environment of products, it truly reflects the cracking, delamination and failure trends of different solder pastes under thermal stress, and provides a direct basis for production lines to screen high-reliability solder pastes, optimize reflow profiles and determine batch stability.
Published: 2014-07-30Excess solder is the most easily overlooked yet highly consequential defect in the SMT printing process. Excessive solder paste transfer is directly caused by oversized stencil apertures and improper setting of squeegee angle, pressure, and speed parameters, which in turn triggers cascading issues such as bridging between pads, tombstoning, and post-reflow solder balls. On-site data from JJY shows that when the aperture area ratio exceeds 1.05 and the squeegee pressure is >6.5kg, the incidence of excess solder increases by 3.2 times.
Published: 2014-07-15
Solder paste can significantly reduce oxidation, improve wettability, and lower void rate in a nitrogen reflow soldering environment, with particularly notable improvements in soldering yield for OSP copper pads, fine-pitch QFNs, and 0201 components. Nitrogen purity must be stably controlled above 99.99% to deliver practical benefits.
Published: 2014-07-14SGS solder has passed authoritative SGS testing and a complete report has been issued. All environmental protection indicators, including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers, can be traced batch by batch, meeting the mandatory requirements of IEC 62321 and RoHS 2.0, providing verifiable compliance assurance for SMT production lines.
Published: 2014-06-23During the FPC soldering process, the flexible board is prone to deformation when heated, which is a high-frequency failure point on the production line. Engineers from Jia Jinyuan adopted a combination of measures, including optimizing stencil aperture design, adjusting reflow soldering conveyor speed and temperature gradient, and using dedicated fixtures for pressing, to increase the first-pass yield of FPC soldering from 72% to 96.5%, focusing on solving three major pain points: solder paste misalignment, insufficient solder wetting on pads, and substrate wrinkling.
Published: 2014-06-09In circuit board soldering, cold solder joints, solder beads, and voids are high-frequency defects on production lines, directly affecting first-pass yield and long-term reliability. Based on 20 years of practical data from the Jiajinyuan SMT production line, this paper focuses on key intervention points such as solder paste printing accuracy, dynamic matching of reflow profiles, stencil aperture optimization, and nitrogen concentration gradient control, and provides immediately implementable parameter adjustment combinations and failure reproduction verification methods.
Published: 2014-05-14Reflow ovens are core equipment in SMT production lines that enable precise solder melting and reliable connections. By precisely controlling the temperature ramp-up rate, soaking time, and peak temperature through segmented temperature control, they directly affect the occurrence rate of defects such as cold solder joints, tombstoning, and cold soldering. Jiajinyuan reflow ovens can stably support 0201 components and QFN5x5 double-sided mixed mounting processes in actual mass production.
Published: 2014-04-28
Severe spatter during solder wire welding is mostly caused by violent flux volatilization, excessively high soldering iron temperature, or moisture absorption of the solder wire. Combined with actual production line measurements, it was found that when the ambient humidity exceeds 65%RH and the solder wire is stored unsealed for more than 72 hours, the welding spatter probability increases by 3 times. Lowering the soldering iron temperature from 380℃ to 320℃ and using it in conjunction with a preheating plate can reduce solder wire welding spatter by nearly 80%.
Published: 2014-04-25Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.