Harness Terminal Solder

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Harness Terminal Solder
Home Harness Terminal Solder Connector Processing Harness Terminal Solder, Wire Terminal Connector Soldering Solder

Connector Processing Harness Terminal Solder, Wire Terminal Connector Soldering Solder

Harness Terminal Solder Knowledge

Here you can find knowledge about Harness Terminal Solder, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.

Lead-Free Tin Material for Tin Dipping Process, Suitable for Harness Connector Terminal Processing

Using lead-free solder in the tin dipping process can significantly improve the solderability and corrosion resistance of wiring harness connector terminals, meeting RoHS environmental protection requirements. Jiajinyuan SAC305 series lead-free solder achieves uniform coating thickness control of 8-12 μm at a melting point of 183°C, adapting to the cycle time of continuous tin dipping production lines for terminals with wire diameters of 0.3mm-1.2mm.

Published: 2020-09-26

Hand Soldering Wire Harness Terminals: Large-Size Solder Wire Joints are Full, Plump and Firm

When manually soldering wiring harness terminals, using large-size solder wire of 1.6mm or above with a soldering iron temperature of 350℃±10℃ can achieve full-formed solder joints at one time without cold soldering, sharp tips or dry joints, significantly improving the electrical connection reliability of the wiring harness under vibration conditions. This process has been batch verified on multiple new energy vehicle high-voltage wiring harness production lines of JJY.

Published: 2016-10-29

Lead-Free and Environmentally Friendly Connector Solder, Export Wire Harness Connector Manufacturing

The production of export wiring harness connectors must comply with the RoHS lead-free regulations, and connector solder must adopt compliant ratios such as Sn96.5/Ag3.0/Cu0.5. Jiajinyuan solder has stable wettability at a peak temperature of 245℃, and is compatible with terminal crimping and reflow soldering of multiple specifications with wire diameters ranging from 0.13 to 2.5mm. In mass production, the defect rates of solder balls, cold soldering, insufficient solder climbing and other defects are controlled within 800ppm.

Published: 2015-05-10
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