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To address production-line pain points in high-density PCB assembly, such as poor solder climbing in QFN/DFN packages, high voiding rates, and whitish residues, this paper draws on 20 years of frontline SMT experience to directly recommend domestic solder paste models suited to different process windows, covering three core needs: high-density solder paste, PCB solder paste, and domestic solder paste. It focuses on analyzing the measured performance of series including 8MQP/5RQ, 8M9P/5RR, and 8MNTTP/5RNTT in terms of solder climbing rate, halogen control, alloy powder particle size distribution, and reflow compatibility.
Published: 2009-01-05The selection of solder paste for production lines must closely align with the process window, component structure, and downstream requirements. SMT solder paste must match the reflow profile, solder wetting ability, and residue characteristics. Domestic solder pastes now cover all scenarios including high-temperature, medium-low temperature, laser, water-washable, and ultra-low-temperature applications. For example, the Jiajinyuan 8MQP/5RQ series achieves nearly 100% solder wetting rate on QFN packages, while the 8M9P/5RR series delivers zero halogen content and extremely low voidage, meeting the high thermal reliability requirements of applications such as automotive lighting.
Published: 2009-01-03Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.