JJY Tinsolder Бренд
Локализованная поставка профессиональных материалов для электронной пайки, комплексное решение для закупки паяльной пасты, припойной проволоки и стержней, а также пробные испытания и техническая поддержка.
We are a professional solder paste manufacturing facility headquartered in Shenzhen, China, serving electronics assembly companies across IndiaHaryana (Gurugram / Bawal) with consistent, high-performance materials including solder paste, solder wire, and solder bar.
A local contract manufacturer in Gurugram reported repeated solder joint defects using imported lead-free solder paste—bridging and inconsistent reflow behavior affected yield. After switching to our standard SAC305-based solder paste with controlled metal load and rheology profile, their first-pass yield improved by 12% over three consecutive production batches.
In Bawal, an automotive electronics supplier required medium-temperature solder paste compatible with thermal-sensitive components and existing stencil printing lines. Our water washable formulation enabled seamless integration without line modification or additional cleaning equipment.
Our production base operates 5,000 sqm of ISO-certified space equipped with 96 units of precision mixing, viscosity control, and particle size analysis systems. Full-range offerings include lead-free and leaded solder paste variants, solid forms such as solder wire and solder bar, alongside complementary fluxes—no-clean and water washable types included.
All shipments to IndiaHaryana (Gurugram / Bawal) utilize constant-temperature packaging to preserve paste stability during transit. Dedicated courier partnerships ensure delivery within 5–7 business days from dispatch, with sample kits available for evaluation prior to bulk order placement.
Technical assistance is provided remotely by certified SMT process engineers, covering stencil design recommendations, reflow profile optimization, and defect root cause analysis—support extended to on-site consultation for qualified volume commitments.








