The storage method, temperature, stirring and other usage methods of Solder Paste are operated so that SMT production has standardized requirements for solder paste. The entire processing of solder paste by Solder paste manufacturer needs to be monitored. So, what are the specification requirements for solder paste? JJY would like to inform its partners:
Because Solder paste is easily affected by environmental factors such as air and humidity, it is essential to monitor its specification requirements. Under normal circumstances, its shelf life is 6 months.
Solder paste taken out of cold storage should not be placed in a warm area immediately, to avoid contact with moisture in the air. It should be thawed at room temperature for 4 hours, then the lid is unscrewed and checked. If there is no delamination, it can be used normally; if delamination occurs, it needs to be tested and confirmed problem-free before use.
Used solder paste, after the lid is unscrewed, is recommended to be used up within the same day. Unused solder paste should be stored separately back in cold storage. For printed solder paste, assembly must be completed within the same day; otherwise, the PCB must be thoroughly cleaned and the solder paste re-printed before assembly.
When printing, it is necessary to control the thixotropy to be relatively low in order to reduce Flux emission. The suitable temperature for solder paste printing is between 20 and 26 degrees Celsius, and the air humidity should be moderate. When the relative humidity of the air is high, the rate at which the solder paste absorbs water vapor increases, which can easily lead to the formation of solder beads. High humidity also has a significant impact on SMT quality.
Shenzhen JJY Industrial Technology Co., LTD is a company that has been engaged in the research of solder paste, Solder Wire, lead-free solder paste, Leaded Solder Paste, solder rods, and related products for more than ten years and is a Solder paste and solder wire manufacturer.
Related Articles
- How to select solder paste for fine pitch QFN assembly without bridging
- What should be noted when soldering with lead-free solder wire?
- Troubleshooting inconsistent solder paste release from nano coated stencils
- How to select and handle solder paste for fine pitch SMT assembly
- Best practices for stencil printing with lead free solder paste
- Adjusting aperture design to improve solder paste release for 01005 components
- What Are the Solder Paste Manufacturers in Changzhou?
- Solder bridging between adjacent pins causing short circuits, key prevention for fine-pitch ICs




