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Bridge formation is one of the most frequent soldering defects on SMT production lines. Low solder paste viscosity leads to aggravated slump after printing, while overly large stencil apertures directly expand the excess solder volume margin. The combination of the two makes it extremely easy to form solder bridges between adjacent pads. For the commonly used 8800 series solder paste from JJY, when its viscosity at 25℃ falls below 140 Pa·s and the aperture area exceeds the pad by more than 15%, the incidence of bridge formation rises significantly.
Published: 2025-01-01Nitrogen reflow significantly suppresses the oxidation reaction between metal powder and flux in solder paste during the high-temperature phase by reducing the oxygen concentration in the furnace to below 100 ppm, thereby improving the wetting ability of solder on PCB pads and component pins. It is particularly effective in addressing poor wetting issues on OSP surface-finished boards and fine-pitch QFN packages, and is a process optimization method validated as effective on JJY's production line.
Published: 2024-12-11
The occurrence of solder balling during the reflow soldering process is not necessarily a quality issue with the solder paste itself; it is more often related to the coupling of multiple factors such as printing parameters, stencil design, temperature zone settings, and ambient humidity. Especially when the solder paste is unevenly heated during the reflow stage or the solvent volatilizes insufficiently, splashing-type solder balls are highly likely to be induced. Therefore, troubleshooting should start from the storage conditions of the solder paste, the matching of the reflow soldering profile, and the coordination of the PCB pad layout.
Published: 2024-12-02Before the delivery of foreign trade orders, solder sample testing must be conducted. Key parameters such as melting point, wettability, and residual ion content are verified through pre-sampling tests to avoid rejection or returns by overseas customers due to batch differences. Jia Jinyuan's measured data shows that the defect rate of export batches without solder sample testing is as high as 12.7%, while the customer complaint rate for orders following standard sampling procedures is reduced to within 0.3%.
Published: 2024-11-15When soldering communication base station motherboards with high-frequency boards, it is necessary to cope with long-term cyclic working conditions from -40℃ to +85℃. Jiajinyuan optimized solder paste selection, stencil aperture compensation, and segmented temperature control of the reflow soldering profile, reducing the solder joint void rate to ≤8%. After 2000 thermal shocks, the impedance fluctuation remains <3%, ensuring the stability of 5G millimeter-wave signal transmission.
Published: 2024-10-14RoHS solder fully meets the requirements of EU environmental directives. Jiajinyuan lead-free solder paste achieves stable printing of 0.3mm fine-pitch QFN on SMT production lines, with a wetting angle of less than 35° after reflow and a void rate of less than 15%. When paired with solder wires and bars of the same system, it can ensure consistent process windows for wave soldering and manual soldering, avoiding poor wetting or abnormal thickening of the IMC layer caused by mixed use.
Published: 2024-09-16
Solder paste and red glue processes can be mixed on the same PCB, but the physical isolation between the red glue dispensing position and the solder paste printing area must be strictly controlled, the reflow soldering temperature profile must take into account both the red glue curing and solder paste melting windows, and the stencil aperture design, dispensing parameters and AOI inspection strategy must be collaboratively optimized. Otherwise, it is extremely easy to cause batch defects such as cold solder joints, tombstoning or red glue contamination of pads. This is a high-risk but implementable special process combination in SMT processes.
Published: 2024-09-13To address common solder paste defects during the dispensing process, such as stringing and paste breakage, this paper examines five key factors: viscosity, thixotropic index, metal content, flux activity, and storage temperature. By combining these factors with actual production line measurement data, it proposes an immediately actionable solder paste parameter optimization pathway, providing a direct basis for dispensing solder paste selection and process matching.
Published: 2024-09-01Soldering 01005 components poses extreme challenges to the accuracy of high-speed placement machines, the consistency of solder paste printing, and the uniformity of the reflow soldering thermal field. Through dual-track synchronous visual positioning, 0.02mm-level Z-axis closed-loop compensation, and a gradient temperature zone control system, Jiajinyuan equipment controls solder joint offset within ±12μm in mass production, effectively addressing typical failures such as tombstoning, cold solder joints, and uneven pad wetting during 01005 component soldering.
Published: 2024-08-21Solder paste selection must match the actual pad pitch and stencil aperture size. T3 to T6 solder powder particle sizes directly affect the printing accuracy and slump control of fine-pitch solder paste. Among them, T4 (25–45μm) is suitable for 0.4mm pin pitch, T5 (15–25μm) is adapted for fine-pitch solder paste applications of 0.3mm and below, while T6 (5–15μm) is only limited to CSP or FCCSP packages below 0.2mm and requires nitrogen reflow and high-precision printing equipment.
Published: 2024-08-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.