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Here you can find knowledge about Solder Paste Viscosity, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Excessive post-solder residues from halogen-free solder paste is a common pain point in SMT production lines, as it is difficult to clean and prone to causing excessive ionic contamination or false ICT test results. Selecting a matching water-based cleaning agent and optimizing cleaning process parameters can control surface ionic residue within 0.28μg/cm2 NaCl equivalent, significantly improving the yield and long-term reliability of high-density PCBA.
Published: 2026-08-27
Improper storage of solder paste will lead to reduced activity of SMT solder paste, segregation of metal content, and imbalance in solvent volatilization. Continuing to use it for soldering on the production line can easily cause defects such as cold solder joints, tombstoning, solder balls, and bridging, and in severe cases, lead to functional failure of the entire batch of PCBA. Based on 20 years of practical experience in SMT production lines, this article directly addresses the typical risk points of the disconnect between solder paste storage and usage.
Published: 2026-08-27
Frequent solder bridging short-circuit issues in fine-pitch ICs often stem from mismatched solder paste viscosity with printing accuracy and reflow behavior. Based on 20 years of measured data from SMT production lines, this paper points out that solder paste viscosity needs to be controlled within the range of 350±30Pa·s to balance squeegee transfer rate and pad retention, while reducing the risk of solder bridging in fine-pitch ICs.
Published: 2026-08-27
The whitening of wave soldering joints is mostly caused by insufficient purity of solder bars. GB/T 8012—2013 stipulates that the Sn content in tin-based solder shall not be less than 99.3%, the upper limit of Pb impurity is 0.005%, and the total content of harmful elements such as As, Sb, and Bi shall not exceed 0.01%. In actual production lines, every 0.1% decrease in solder bar purity may increase the thickness of the solder joint oxide film by 12%, leading to an abnormal increase in reflectivity and a grayish-white appearance.
Published: 2026-08-27
Insufficient solder paste warm-up time directly causes typical defects in SMT production such as solder balls, cold solder joints, and solder bridges. The root cause is that the viscosity of low-temperature solder paste increases abnormally at low temperatures, leading to poor printing release and reduced flux activity. It is necessary to strictly implement the three-step control of 4-hour room-temperature standing + shaking before opening + viscosity measurement after warm-up, to ensure that the solder paste is fully warmed up before being put into SMT production.
Published: 2026-08-27
Frequent solder wire spattering during manual repair soldering has become a common pain point in production line rework processes. The root causes lie in the mismatch between the flux volatilization rate and the soldering iron heat conduction, excessive oxygen content in the solder wire, and improper operation rhythm. The industry is currently accelerating its development along three parallel tracks: low-spatter active solder wire, intelligent temperature-controlled soldering irons, and standardized repair soldering SOP. Frontline engineers need to simultaneously adjust their technique rhythm, verify incoming material batch data, and refine the granularity of on-the-job training.
Published: 2026-08-27
An excessively large ramp-up slope during reflow soldering can easily cause typical solder paste defects such as solder paste splashing, solder balls, tombstoning, and poor wetting. The root causes are violent vaporization of the flux, accelerated oxidation of solder powder, and unbalanced thermal stress on components. Production lines should address this by stepwise optimizing the preheat zone slope, calibrating thermocouple positions, shortening the soaking time, and strengthening cold storage management for solder paste.
Published: 2026-08-27
The size, shape, and wall roughness of SMT stencil apertures directly affect the paste filling, release, and pad coverage during solder paste printing. Improper design can lead to typical defects such as solder bridging, insufficient solder, and misalignment. Based on real production line failure cases, this paper reveals five high-frequency misconceptions, including improper aperture ratio, excessive inverse trapezoid, and unprocessed edge burrs, along with their root-cause solutions.
Published: 2026-08-27
Oxidation of PCB solder pads severely impairs the wettability of SMT soldering and the formation of intermetallic compounds. Even using high-activity solder paste and optimizing the reflow profile cannot compensate for the lack of interfacial bonding strength. The solderability of copper pad surfaces must be restored through source control, chemical activation, and coordinated process parameters.
Published: 2026-08-27
In nitrogen soldering, the dew point control of solder paste directly determines the wettability and void ratio of solder joints. Practical measurement experience shows that the dew point needs to be stably maintained between -40℃ and -50℃. A dew point below -55℃ can easily make the oxide film of the solder paste difficult to break, while a dew point above -35℃ will cause a significant decrease in the activity of the flux. It is only truly effective when paired with a nitrogen purity of ≥99.995% and an oxygen content of <50ppm.
Published: 2026-08-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.