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Rapid oxidation of wave soldering bars will significantly shorten the service life of solder pots and increase solder joint defect rates. Controlling the molten solder temperature is the core means of suppressing solder bar oxidation. In actual production, the wave soldering machine temperature should be stably maintained within the range of 250℃±2℃. Combined with nitrogen protection, regular dross removal, and monitoring of solder bath level, the oxidation rate of wave soldering bars can be effectively delayed.
Published: 2026-08-27
SAC305 solder paste is prone to SMT solder ball defects in the SMT process. The main causes involve multi-dimensional coupling factors such as mismatched flux volatilization gradient, aggravated metal powder oxidation, narrow reflow profile window, and redundant stencil aperture design. Synchronous intervention is required from four aspects: solder paste storage, printing parameters, coordinated adjustment of reflow temperature zones, and stencil maintenance, to stably suppress the formation of SMT solder balls.
Published: 2026-08-27
SMT solder spike problems mostly stem from improper matching of temperature and materials during solder wire welding. Based on measured production line data, this article explains in detail the setting logic for a preheating zone of 120℃～150℃, a soaking zone of 160℃～180℃, and a reflow peak of 235℃～245℃. Combined with parameters such as a solder wire diameter of 0.3mm～0.5mm, RMA grade in J-STD-004B for flux activity, and a chain speed of 1.2m/min, it provides directly applicable temperature zone fine-tuning solutions and root cause determination paths for solder spikes.
Published: 2026-08-27
Poor soldering performance on manual solder wires is mostly caused by the imbalance between flux activity and residue. When selecting a flux, focus on four hard parameters: rosin-based proportion, halogen content, activation temperature, and spreadability. A chloride ion content of 0.5%~1.2%, an activation range of 180℃~220℃, and a spreadability of over 92% are the key thresholds for a reliable manual solder wire flux.
Published: 2026-08-27
Solder paste slump after printing directly affects component placement accuracy and reflow soldering quality. The main causes include low solder paste viscosity, improper stencil aperture design, excessive squeegee pressure, and uncontrolled ambient temperature and humidity. Typical manifestations include blurred edges, bridging, or height drop exceeding 15% within 30 seconds after printing. Systematic troubleshooting should be conducted in combination with practical parameters such as viscosity of 750–950 Pa·s, squeegee angle of 55°–62°, and release speed of 25–40 mm/s.
Published: 2026-08-27
QFN solder balls are a typical high-frequency and difficult-to-reproduce defect in SMT failures, often occurring at the four corners of the QFN bottom thermal pad and within a 0.3mm range around it, directly causing short circuits or false ICT test results. Based on 20 years of practical production line experience, this paper focuses on four key parameters: stencil aperture ratio, reflow profile peak temperature window, solder paste activity level, and print release speed, and provides a closed-loop troubleshooting path from oven temperature measurement to stencil EDS composition verification.
Published: 2026-08-27
The BGA cold solder joint issue cannot be simply attributed to SMT solder paste; a systematic investigation is required into hard parameters such as reflow profile peak temperature (235±2℃), heating rate (1.2~1.8℃/s), soak time (60~90s), as well as solder paste metal content (88.5~89.2%), viscosity (750~850 Pa·s), and particle size D50 (20~25μm). Switching solder paste is only effective when verification confirms insufficient flux activity or excessive metal powder oxidation.
Published: 2026-08-27
The selection of SMT soldering materials must match the specific process path. The activity, melting point, metal content, particle size distribution, and flux type of solder paste, solder wire, solder filament, and solder bar directly affect printing accuracy, reflow forming, and the reliability of manual repair soldering. For example, lead-free solder paste commonly uses the Sn96.5Ag3.0Cu0.5 composition, has a particle size D50 of 25±5μm, and its viscosity is controlled at 700±150Pa·s, while solder wire for manual soldering needs to match the soldering iron temperature of 320℃～350℃ and the heat capacity characteristics of the pads.
Published: 2026-08-27
Addressing the practical pain point of persistently high solder costs for materials such as solder paste and solder wire in multi-variety, small-batch SMT production lines, this analysis starts from typical phenomena including fluctuations in printing defect rates, severe line changeover waste, and material expiration and obsolescence caused by frequent batch switching. It systematically sorts out the key bottlenecks in solder cost reduction, and proposes immediately implementable practical paths based on accurate material usage forecasting, dynamic solder paste mixing, segmented cutting and reuse of solder wire, and supplier-collaborated VMI inventory, to effectively support solder cost reduction in small-batch SMT scenarios.
Published: 2026-08-27
Excessive impurities in solder bars directly cause wave soldering defects, common defects include solder spike, bridging, cold solder joint and PCB surface blackening. Solder bars with copper content >0.3wt%, iron content >0.02wt%, and arsenic content >0.005wt% are highly likely to cause reduced solder fluidity, increased dross, and increased wetting angle at a soldering temperature of 255℃±5℃.
Published: 2026-08-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.