LFP-JJY5RW1-0307T4 water-washable lead-free high-temperature solder paste is adapted to low-silver alloy systems and paired with the ORH1 water-washable flux. It provides smooth printing and filling with stable long-run mass-production consistency, combining excellent wetting performance with low-cost production.

It has extremely strong activation capability on components with common PCB surface finishes such as bare copper, OSP and immersion gold; the high-activity formula quickly removes oxide on pads, giving full solder climb on QFN, fine-pitch ICs and small resistors/capacitors, effectively avoiding batch issues such as cold joints, insufficient solder and poor wetting.

Unlike conventional no-clean pastes, the residue after soldering can be cleaned directly with pure water, without organic solvent cleaners, substantially cutting cleaning-material procurement and waste-liquid disposal costs. After washing, the board is clean with no white haze, and the washing step does not corrode fine circuits or molded component housings.

It supports T3 and T4 powder sizes and adapts to single- and double-layer multi-pass reflow conventional SMT processes. All raw materials and finished products pass SGS testing and fully meet the RoHS environmental control directive, making it lead-free compliant for high-volume production of consumer electronics, industrial power supplies and appliance motherboards.