How to solve common quality problems such as false soldering and missed soldering on the SMT assembly line?

inSMTOn the surface mount production line, common quality issues such as false soldering and missed soldering have always been challenges faced by manufacturers. These quality problems not only affectedPCBAThe shipment efficiency is not only poor but also poses a threat to the reliability of the products. To effectively avoid these problems, we need to start from two aspects: process optimization and quality control. Below is Shenzhen JJYSolder paste manufacturerLet me give you a brief introduction:

I. Process Optimization:

1Solder paste printing process adjustment: InSMTDuring the surface mount technology (SMT) process, the printing of solder paste is a crucial step. Select steel mesh holes of appropriate size and shape to ensure that the solder paste can be printed evenly and in appropriate amountsPCBOn the solder pad. Meanwhile, adjust the pressure and speed applied to the steel wire mesh to ensure that the solder paste can be printed correctly and stably.

2Solder paste quality control: The freshness and viscosity of solder paste directly affect the soldering quality. Make sure the solder paste is used within its validity period to avoid poor soldering caused by expiration or drying.

Ii. Quality Control:

1Improved placement accuracy: Use high-precision placement machines and conduct regular alignment system calibration to ensure that components can be precisely placed on the designated pads. This can effectively reduce the problems of false soldering and missed soldering caused by inaccurate placement of the surface mount.

2Cleanliness managementPCBDust, oil stains or oxide layers and other contaminants on the surface of components can affect the formation of solder joints. Therefore, during the production process, regular cleaning should be carried outPCBEnsure the cleanliness of the welding environment and the surface of the components.

3Furnace temperature curve optimization: Optimize the furnace temperature curve for the soldering process to ensure that the solder paste can be fully melted and form good solder joints. This can not only improve the welding quality, but also reduce the energy consumption during the welding process.

4,AOIDetection application: Utilizing automatic optical detectionAOIThe equipment can promptly identify quality issues such as false welding and missed welding during the welding process and carry out timely repairs, which is conducive to improving production efficiency and product quality.

5Packaging and transportation control: maintained during the conveying processPCBSmooth operation to prevent component displacement or solder joint deformation. Meanwhile, appropriate protective measures should be taken during the packaging process to ensure that the products are not damaged during transportation.

To ensure the effective implementation of the above measures, it is generally necessary to provide regular training and skill improvement for operation and quality control personnel. Through training, they can have a better understandingSMTKey links and quality control points in the surface mount technology (SMT) process, enhancing the ability to identify and solve problems.

To sum up, through multiple measures such as process optimization, quality control and staff training, we can effectively avoid itSMTQuality issues such as false soldering and missed soldering during the surface mount technology (SMT) process can be addressed to enhance production efficiency and product reliability.

Shenzhen JJY Industrial Technology Co., Ltd. mainly engages in the production and operation of:SMTSolder paste manufacturers of solder paste, syringe solder paste, lead-free solder wire, wave soldering bar, automatic soldering wire, etc.