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Tin-Lead Solder Paste
TLP-JJY721-62362T4 halogen-free lead-containing solder paste

Brand:JIAJINYUAN/JJY

Model:TLP-JJY721-62362T4

Alloy composition:Sn62Pb36Ag2.0

Particle size:4#(20-38um)

Viscosity:60±10(Pa·S)

Activity: Weak activity

Melting point:179℃

Working temperature:210-225(℃)

Specification:500g/bottle

Product Description product description

There is lead solder paste<="">

TLP-JJY721-62362T4Halogen-free leaded solder paste is made from a scientific formula and spherical solder powder with low oxidation degree. At the same time, it is refined with imported chemical materials to form a paste, which can achieve very high stability and effect. It has good demolding performance during printing, excellent dry resistance and good thixotropic performance, and can be applied to0.4mmThe printed solder paste for fine-pitch pads isRMAFlux and tin powder particles are uniformly mixed. Fewer solder beads are produced during welding, reducing the occurrence of short circuits. Applicable to0.4mmPrinting of fine-pitch pads and fine-pitchQFN,BGAThe mounting of devices. There is little residue after welding, with low corrosiveness. It has an extremely high surface insulation resistance value and can achieve excellent results without cleaningICTTest performance.

On-time deliveryThe on-time delivery rate is as high as99%
Consult immediately
Scope of application Scope of application
Wide range Suitable for high activityQFN/DFNDedicated scene for climbing Xigao;
Technical parameters Technical Parameters
Project gauge    lattice ginseng test mark quasi
stick  Degree of 160±10Pa.S IPC-TM-650
tin  bead PASS IPC-TM-650
Continuous printing capacity 10More than one hour IPC-TM-650
Flux content 10%
Copper mirror corrosion test
 PASS
Surface insulation impedance value Initial value
 1.0×1013Ω
 IPC-TM-650
(SIR) After the hot and humid weather
 1.0×1012Ω
Expansion rate 90% JIS-Z-3197(1999)
Viscosity retention Qualified IPC-TM-650
Collapse test    

Shelf life2～10℃) 6One month
Printability right0.4mmThe foot distance to the substrate is well printed
Product display Product Show

There is lead solder paste<="">

There is lead solder paste<="">

Product Features Product characteristic
  • 1 The weld points are firm, bright and full 12With years of R&D and production experience, we have scientifically mastered modern process formulas, ensuring that the solder paste is highly compatible with the soldered products. The solder joints are firm, bright, uniform, full and free of solder beads.
  • 2Low residue, no need for cleaning We have developed and formulated a no-wash environmentally friendly flux, which leaves little residue after welding, has high insulation resistance, a clean board surface without corrosion, and forms a protective layer to prevent the substrate from oxidizing again.
  • 3 It has strong wettability and good tin crawling High-performance thixotropic agents are added to the solder, making the solder paste highly active. The molten solder paste significantly wets the solder pad, reducing the phenomenon of false soldering during the soldering process.
  • 4 The printing is stable and has good demolding properties The tin powder particles have good roundness and uniform size. During printing, there is no trailing, sticking or splashing phenomenon. There is no collapse, sharp or continuous tin connection during molding. The viscosity change is small during continuous printing, and it does not dry out. The components do not shift.
Instructions for Use Instructions for use

Instructions for Use in5-10℃The storage period under the environment is6Months, not less than0℃Store under such conditions and thaw before use2-4It should be left to room temperature for more than an hour before opening to prevent the formation of tin beads due to moisture. Then stir well before use.


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