Product Name:Lead Free Solder Bar-Dip-Higher Temperature
Alloy:Sn96.5Ag3.5
Size(approx.):Trapezoidal Section(P18、Q25、H25)*L326 (MM)
Per Bar(approx.):1.105KG
Feature:Produced by pure tin and silver.Impurities are lowed to the minimum.
Application:For dip soldering process.
Packaging:Net weight 20KG/CTN
Shelf Life:2 Years
JJY Sn96.5/Ag3.5 is designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations.
JJY Sn96.5/Ag3.5 alloy has higher melting temperature than standard SAC alloys so may be used when high temperature assembly
is required.
The high silver content of JJY Sn96.5/Ag3.5 alloy contributes to stronger, shinier joints.
JJY Sn96.5/Ag3.5conforms and exceeds the impurity requirements of IPC-J-STD-006C and all other relevant international
standards.
For stabilization of copper, Cu content in the soldering pot(Sn-Ag-Cu), JJY Sn96.5Ag3.5 alloy will be recommended as a top up solder.
Specification
SPECIFICATION
Item |
Specification |
Alloy Composition |
Sn96.5Ag3.5 |
Appearance |
Bright and shiny surface finishes |
Shape |
Bar |
Melting Point |
Approx. 221°C |
Density |
Approx. 7.5 g/cm³ |
Electrical Conductivity |
Approx. 14 %IACS |
Electrical Resistivity |
Approx. 12.3 μΩ.cm |
Soldering Temperature |
300-400°C |
Oxidation Resistance |
Good |
Amount of tin slag |
A small amount |