Product Name:Lead Free Solder Bar-Dip-Higher Temperature
Alloy:Sn95.5Ag3.8Cu0.7
Size(approx.):Trapezoidal Section(P18、Q25、H25)*L326 (MM)
Per Bar(approx.):1.105KG
Feature:Produced by pure tin and silver.Impurities are lowed to the minimum.
Application:For dip soldering process.
Packaging:Net weight 20KG/CTN
Shelf Life:2 Years
JJY Sn95.5Ag3.8Cu0.7 is designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations.
JJY Sn95.5Ag3.8Cu0.7 solder alloy was developed to have better fluidity and low drossing in dipping soldering process.
For stabilization of copper, Cu content in the soldering pot, JJY Sn96.5Ag3.5 alloy will be recommended as a top up solder.
JJY Sn95.5Ag3.8Cu0.7 is also developed to have better wetting and spread ability.
Specification
Specification
Item |
Specification |
Alloy Composition |
Sn95.5Ag3.8Cu0.7 |
Appearance |
Bright and shiny surface finishes |
Shape |
Bar |
Melting Point |
Approx. 217°C |
Density |
Approx. 7.5 g/cm³ |
Electrical Conductivity |
Approx. 13 %IACS |
Electrical Resistivity |
Approx. 13 μΩ.cm |
Soldering Temperature |
300-400°C |
Oxidation Resistance |
Good |
Amount of tin slag |
A small amount |