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Lead-Free Solder Bar
Lead Free Solder Bar-Dip-Higher Temperature Sn95.5AG 3.8Cu0.7

Product Name:Lead Free Solder Bar-Dip-Higher Temperature

Alloy:Sn95.5Ag3.8Cu0.7

Size(approx.):Trapezoidal Section(P18、Q25、H25)*L326 (MM)

Per Bar(approx.):1.105KG

Feature:Produced by pure tin and silver.Impurities are lowed to the minimum.

Application:For dip soldering process.

Packaging:Net weight 20KG/CTN

Shelf Life:2 Years

Product Description PRODUCT DESCRIPTION
Lead-free tin bar

JJY Sn95.5Ag3.8Cu0.7 is designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations.
JJY Sn95.5Ag3.8Cu0.7 solder alloy was developed to have better fluidity and low drossing in dipping soldering process. 
For stabilization of copper, Cu content in the soldering pot, JJY Sn96.5Ag3.5 alloy will be recommended as a top up solder. 
JJY Sn95.5Ag3.8Cu0.7 is also developed to have better wetting and spread ability.

On-time deliveryThe on-time delivery rate is as high as99%
Scope of application SCOPE OF APPLICATION
Wide range For dip soldering process with ROHS complianted.
Product display PRODUCT SHOW

Lead-free tin bar

Lead-free tin bar

Product Features PRODUCT CHARACTERISTIC
  • 1 The speed of going to tin is very fast Strictly adhering to national standards, it is made of high-purity primary refined tin, electrolytic copper and pure silver materials. After melting, it has low viscosity, good wettability, high fluidity, excellent solderability and is easy to solder, effectively improving the welding efficiency.
  • 2Strong antioxidant capacity The proprietary anti-oxidation alloy technology endows the tin bars with unique anti-oxidation properties, ensuring a very low oxidation slag production rate during the welding process and reducing unnecessary waste.
  • 3 The weld points are bright and firm After special process adjustment and refining treatment, the metallographic particles are very fine, the weld points are firm, bright and full, without false welding, voids, sharp points or bridging phenomena, and there are no residual impurities after welding.
  • 4 Ultra-low slag discharge technology The unique high-antioxidant formula, combined with free on-site technical services provided by engineers, such as reasonable setting of temperature, peak height, chain speed, slag removal and tin strip addition time points, inspection and correction of components, flux compatibility, etc. To effectively maintain the stability of solder composition, find the balance point between efficiency and stability, and control the slag discharge rate at7~20%. Free on-site tin cleaning service. High price for tin slag recycling or exchange for brand new tin bars.


Specification

Specification


Item

Specification

Alloy Composition

Sn95.5Ag3.8Cu0.7

Appearance

Bright and shiny surface finishes

Shape

Bar

Melting Point

Approx. 217°C

Density

Approx. 7.5 g/cm³

Electrical Conductivity

Approx. 13 %IACS

Electrical Resistivity

Approx. 13 μΩ.cm

Soldering Temperature

300-400°C

Oxidation Resistance

Good

Amount of tin slag

A small amount


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