inSMTDuring the processing, the surface mount technology (SMT) processing factory sometimes encounters some poor processing issues, such as false soldering. This isSMTCommon processing defects in surface mount technology (SMT) processing. The following is a brief introduction by Shenzhen JJY Solder Paste Manufacturer on the common judgment methods and solutions for false soldering:

I. Judgment of False Soldering

1The online tester is tested by professional equipment.

2Visual orAOIInspection. During the inspection process, the surface mount technology (SMT) processing factory found that the soldering material at the solder joints was insufficient or the solder wetting was poor, or there were broken seams in the middle of the solder joints, or the surface layer of the solder was convex spherical, or the solder andSMDIssues such as non-compatibility need to be taken seriously. Even minor problems can lead to potential hazards in the product. It is necessary to promptly determine whether there might be a false soldering problem throughout the entire batch. The method of judgment is:Take a lookPCBAre there any more solder joints at the same position on it? Are there any problems? If it's just an individualPCBSome of the problems on it might be caused by the solder paste being scratched or the pins being deformed. If there are manyPCBIf there is a problem at the same position, it is very likely caused by poor components or problems with the solder pads.

Ii. Causes and Solutions of False Soldering

1There is a defect in the pad design

There are through holes in the solder padPCBOne major drawback of the design is that it is usually avoided as much as possible. Through-holes can cause solder loss, resulting in insufficient soldering materials. The pad spacing and area also need to be standardized and matched. Otherwise, the design should be corrected as soon as possible.

2,PCBBoard defect

PCBOxidation, the manifestation of this situation is mostlyPCBThe solder pad is dull and not shiny. IfPCBAThere is oxidation. The oxide layer can be removed with an eraser to restore its luster. IfPCBIf the board gets damp, it can beSMTDry in a drying oven before surface mount technology (SMT) processing. IfPCBThe board is contaminated with oil stains, sweat stains, etc. It can be cleaned thoroughly with anhydrous ethanol.

3Printed with solder pastePCBThe solder paste was scratched

In this case, the amount of solder paste on the pad decreases, resulting in insufficient soldering material, which needs to be replenished immediately.

As a 15-year-old veteran solder paste manufacturer, JJY has always been committed toSolder pasteThe company is engaged in the research and development, production and sales of solder paste. The quality of the solder paste is stable, without solder connection, false soldering or monument erection. No residue, Wuxi beads, bright, full, firm solder joints with excellent electrical conductivity. If you have any needs, please feel free to contact us.