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How to solve the problem of soldering porosity in SMT assembly?

Return to List source: JJY Release Date: 2024.01.30

Welding porosity isSMTOne of the more common processing defects in the rapid prototyping and processing production process is that the welding porosity is generally presentSMTDuring the reflow soldering and through-hole wave soldering processes in surface mount technology (SMT) processing. The existence of welding holes not only affects the appearance of the sheet, but also influences the welding quality of the weld points. So, how is this problem solved in welding processing? Below is Shenzhen JJYSolder paste manufacturerLet me introduce some common preventive methods to you all:

Solder paste

1Baking

Circuit boards and components that have not been used for a long time and are exposed to the air may contain moisture. After a period of time or before use, they should be baked to prevent moisture from affecting themSMTThe surface mount technology (SMT) processing has an impact.

2Solder paste

Solder paste forSMTThe processing in the factory is also very important. Moreover, if the solder paste contains moisture, it is prone to cause defects such as pores or solder beads during the soldering process.

When choosing solder paste, one must not cut corners. Only high-quality solder paste should be selected, and before using the solder paste, strict processing procedures such as tempering and stirring must be carried out in accordance with the processing requirements. inSMTDuring the surface mount technology (SMT) process, solder paste should not be exposed to the air for a long time. After the solder paste is printed in the SMT printing process, reflow soldering must be carried out as soon as possible.

3Workshop humidity

The humidity in the processing workshop is forSMTFor a rapid prototyping workshop, it is also a very important environmental factor. Generally, it is controlled within40%-60%.

4Furnace temperature curve

The furnace temperature should be detected strictly in accordance with the standard requirements of the electronic processing factory, and the furnace temperature curve should be optimized in a planned manner. The temperature in the preheating zone needs to meet the requirements to ensure that the flux can fully volatilize, and the speed of passing through the furnace should not be too fast.

5Flux

During the wave soldering process in electronic processing, the amount of flux sprayed should not be excessive and should not be too much.

Shenzhen JJY Industrial Technology Co., Ltd. is located in Longhua, Shenzhen. Its main business isLEDType solder paste, lead-containing solder paste, lead-containing silver solder pasteSMTProduction, research and development, and customization of solder paste, leaded solder wire, lead-free and leaded solder rods, wave soldering rods, automatic soldering wires, etc. If you have any needs, please feel free to contact us.

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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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