The causes and countermeasures of smt patch BGA solder joint breakage

In the field of modern electronic manufacturing,smtSurface mount technology (SMT) is a widely used assembly technique and is very common in the manufacturing process of electronic products.BGAIt is a common type of packaging, insmtIt is widely used in surface mount technology. However, due to various factors, it may lead tosmtPatchBGAThe solder joint broke. BelowSolder paste manufacturerSeveral possible reasons and countermeasures will be introduced. We hope it can be of some help to you!

1,smtThe issue of surface mount technology (SMT) furnace temperature: The soldering temperature has an impactsmtOne of the important factors affecting the quality of surface mount solder joints is that if the temperature is too high or too low, it may lead to solder joint breakage or poor soldering. The countermeasure is to reasonably control the welding temperature and ensure that the welding is carried out within an appropriate temperature range. In addition, the use of high-quality solder paste and the correct process can also enhance the strength of solder joints.

2,PCBDesign issues: Design issues may also lead to solder joint fractures, for example,PCBThe design of the board is unreasonable, the shape of the solder pads is improper, or the wiring is poor, etc. The countermeasure is to improve the quality of solder joints through optimized design, ensure that the shape and size of the solder pads meet the requirements, and at the same time enhancePCBThe structural strength of the plate.

3Mechanical stress: Mechanical stress refers to the stress caused by external forces or vibrations and other factors during use or handlingsmtPatchBGADeformation of the solder joint. This mechanical stress may cause the solder joint to break. The countermeasure is to fully consider the influence of mechanical stress when designing the product and use appropriate protective measures such as buffer materials or shock absorption devices to alleviate the force on the solder joints.

4,PCBBoard material issue:PCBThe material of the sheet will also affect the quality of the weld points, if it is selectedPCBIf the sheet material is too fragile or lacks sufficient rigidity, it may lead to the fracture of the weld points. The countermeasure is to choose the appropriate onePCBThe plate material should be ensured to have sufficient rigidity and toughness to reduce the risk of weld point fracture.

5,smtSurface mount technology issuessmtThe surface mount technology (SMT) process is diverse and complex. Poor processing is also a cause of solder joint breakage. For instance, non-standard operations during the welding process, instability of equipment, etc. The countermeasures are to enhance the training of employees, ensure the standardization of operations, and at the same time, regularly inspect and maintain the welding equipment to guarantee its stability and reliability in operation.

6,smtSurface mount environmental factors:smtThe environmental factors of the surface mount may also have an impact on the quality of the solder joints. For instance, excessive humidity or the presence of corrosive gases can both lead to solder joint breakage. The countermeasure is to maintain appropriate environmental conditions during the welding process, such as controlling humidity and preventing the invasion of corrosive gases.

To sum up, in order to avoidsmtPatchBGASolder joint fracture requires comprehensive consideration of temperature, design, mechanical stress,PCBA variety of factors such as sheet materials, manufacturing processes and environmental factors. Through reasonable process control, design optimization and strengthened quality management, the strength and reliability of solder joints can be enhanced, and the risk of solder joint breakage can be reduced. This can ensure the quality and reliability of electronic products and ultimately enhance user satisfaction. The above content is provided by Shenzhen JJY Solder Paste Manufacturer. Welcome to leave a message online and interact with us!