What causes solder paste to collapse during solder paste printing?

Solder pasteThe collapse phenomenon refers to the situation during the printing process where the solder paste fails to maintain a stable shape, its edges collapse and flow to the outside of the pads, while connecting between adjacent pads, resulting in a short circuit in the soldering. There are various reasons for this issue. The following is Shenzhen JJYSolder paste manufacturerLet's discuss together:

First of all, excessive pressure of the scraper is one of the important factors. When the pressure of the squeegee exceeds the tolerance range of the solder paste, the solder paste will be squeezed when passing through the holes of the steel mesh and thus flow into the adjacent pad positions.

The solution is to appropriately reduce the pressure of the scraper.

Secondly, too low viscosity of solder paste is also a common cause. Low-viscosity solder paste is insufficient to maintain its printed shape and is prone to collapse during the printing process. To improve this problem, solder paste with higher viscosity should be selected.

In addition, the tin powder particles being too small is also one of the causes of the collapse. Although small-particle tin powder is beneficial to the desoldering performance of solder paste, particles that are too small may lead to insufficient formation of the solder paste. To solve this problem, solder paste with larger particles should be selected.

In conclusion, understanding and identifying the specific causes of solder paste collapse, and taking corresponding measures, such as adjusting the pressure of the squeegee, choosing solder paste of appropriate viscosity and suitable size of solder powder particles, can effectively avoid or reduce the phenomenon of solder paste collapse, thereby improving the quality of soldering and production efficiency. As a 16-year-old veteran solder paste manufacturer, JJY has been committed to the research and development, production and sales of solder paste. Our product quality is stable, with no solder connection, no false soldering, and no monument erection. Residual Wuxi beads, bright and full solder joints, firm welding, and excellent electrical conductivity. If you have any needs, please feel free to contact us.