Which lead-free high-temperature solder paste manufacturer is better?

Which lead-free high-temperature solder paste manufacturer is better? Shenzhen JJY has a dedicated and powerful technical team that can customize formulas according to customers' process requirements. Solder alloys, flux activity grades, cleaning methods and special properties can all be customized. At the same time, we provide product selection suggestions for customers, optimize the soldering process, and offer suitable soldering solutions for their applications to enhance the first-time pass rate of their products. This is something you can consider. Now, let's take a look at the advantages of this product as introduced by the solder paste manufacturer's editor:

optimalpoint:

1No-wash, low residue, high insulation resistance, and passableICTProbe testing

2It has a good tin-climbing effect and a long service life.

3High activity, low porosity, and not prone to collapse;

4The solder joints are full and bright, with high strength and excellent electrical conductivity.

5Outstanding printing performance and demolding performance, with fine pin spacing, mounting is effortless.

6It adopts imported flux, allowing for long-term printing without affecting the wettability and viscosity of the solder paste.

Lead-free high-temperature solder pasteLFP-0M-305It uses a special formulaRMAA uniform spherical lead-free solder paste with very little oxide contentSn96.5Ag3.0Cu0.5A uniform mixture of tin powder. This product has passedSGSTest compliantRoHSThe instructions contain solder paste that complies with the standards of the United StatesQQ-571As stipulated in itRMAType. This product strives to be highly compatible with the soldered product, with moderate wettability (activity), firm, bright and full solder joints, no solder beads, bridging, false soldering, less residue after soldering, high insulation resistance, good dry resistance, small viscosity change during continuous printing, ensuring the stability of long-term operation printing, good thixotropy and demolding property, good shape retention after printing, not easy to collapse, and components do not shift.