What are the causes of poor SMT solder paste printing?

Solder pasteIt is accompanied bySMTA new type of welding material that has emerged as The Times require is formed by mixing solder powder, flux paste, and other surfactants, thixotropic agents, etc Paste-like mixture. At room temperature, the paste can initially bond electronic components in the predetermined positions. When heated to a certain temperature, as the solvent and some additives evaporate and the alloy powder melts, the components to be soldered and the solder pads are connected together. After cooling, a permanent connection point is formed. The requirements for solder paste are that it has multiple coating methods, especially good printing performance and reflow soldering performance, and stability during storage.

Generally mainly usedSMTIndustryPCBSurface resistance, capacitanceICSoldering of electronic components, etc. In layman's terms, solder paste is a material used to connect the electrodes of components to the pads of circuit boards. This material is an alloy mainly composed of tin. After curing, it can conduct electricity between the electrodes of components andPCBThe function. Now, let's have Shenzhen JJY Solder Paste Manufacturer analyze for you what the reasons for poor printing are?

Cause analysis:

1Insufficient clamping or support of the circuit board, improper parameter Settings orPCBThickness dimension deviation, these factors may cause the printed circuit board to move and result in steel mesh andPCBAlignment offset occurs, and the solder paste is misaligned after printing.

2,PCBDimensional deviations of incoming materials or deformation after a single reflow soldering can both lead to poor matching between the solder pads and the openings of the steel mesh, and the mesh holes and solder pads cannot be fully aligned, resulting in printing misalignment.

3The calibration program is not precise, the program Settings are improper, and the machine parameters orPCBThe deviation in the size setting causes the printing to be misaligned.

4The circuit board was deformed, and the steel mesh holes were not properly aligned with the solder pads, resulting in misalignment.

According to statistics, electronic productsSMTDuring the assembly process, approximately60%-70%The soldering defect was caused by poor solder paste printing. Therefore, the quality of solder paste printing is determinedSMTThe yield rate of surface mount technology (SMT) processing. The key to zero-defect manufacturing is to ensure the quality of solder paste printing and prevent soldering defects caused by poor solder paste printing.

As a 16-year-old veteran solder paste manufacturer, JJY has been committed to the research and development, production and sales of solder paste. The solder paste we produce is of stable quality, without solder connection, false soldering or monument erection. No residue, Wuxi beads, bright, full, firm solder joints with excellent electrical conductivity. If you have any needs, please feel free to contact us.