Six potential factors for component displacement during the SMT assembly process

inSMTDuring the surface mount technology (SMT) processing, component displacement is a common problem, which may lead to a decline in product quality or even product scrapping. As electronic products become smaller and more sophisticated, forSMTThe requirements for surface mount technology are also becoming increasingly strict. Now, Shenzhen JJY Solder Paste Manufacturer will explain it to youSMTSix potential factors for component displacement in surface mount technology (SMT) processing:

1. Improper adjustment of the suction nozzle air pressure of the surface mount technology (SMT) machine

inSMTIn surface mount technology (SMT) processing, the adjustment of the air pressure at the suction nozzle of the SMT machine is of vital importance. If the air pressure is too low, it may cause the components to shift during the process of suction and placement. Therefore, ensuring that the air pressure of the suction nozzle of the surface mount technology (SMT) machine is adjusted to an appropriate range is an important measure to prevent the displacement of components.

Second, the content of flux is too high

Flux is hereSMTFlux plays a crucial role in surface mount technology (SMT) processing, but excessive flux content may cause problems. During the reflow soldering process, excessive flux flow may cause components to shift. Therefore, controlling the content of flux within a reasonable range is an important step to prevent the displacement of components.

Three. Insufficient viscosity of solder paste

Solder pasteIts viscosity plays a crucial role in the fixation of components. If the viscosity of the solder paste is insufficient, the components may oscillate and shake during movement, thereby causing displacement. Therefore, choosing solder paste with sufficient viscosity is the key to ensuring the stable placement of components.

Four. Use of expired solder paste

Solder paste will deteriorate over time during use. If expired solder paste is used, it may lead to poor surface mount soldering and subsequently cause component displacement. Therefore, regularly checking the expiration date of solder paste and using it within the validity period are important measures to prevent component displacement.

V. Oscillation or improper operation during the transfer of components

inSMTAfter the surface mount technology is printed, the components may be affected by oscillation or improper operation during the transfer process, which can cause displacement. Therefore, taking appropriate protective measures and operation methods during the transfer of components, such as using shock-absorbing pads and moving them smoothly, can effectively reduce the risk of component displacement.

Vi. Issues with surface mount Technology (SMT) machines

The surface mount technology (SMT) machine serves asSMTThe core equipment for surface mount technology (SMT) processing has mechanical properties that directly affect the placement of components. If there are mechanical problems with the surface mount technology (SMT) machine, such as worn guide rails or decreased positioning accuracy, these issues may lead to incorrect placement of components, thereby causing displacement. Therefore, regular maintenance and inspection of the surface mount technology (SMT) machine to ensure its good mechanical performance is an important guarantee for avoiding component displacement.

In conclusion,SMTComponent displacement in surface mount technology (SMT) processing is a problem that requires high attention. By adjusting the air pressure of the suction nozzle of the surface mount technology (SMT) machine, controlling the flux content, choosing the appropriate solder paste, ensuring the solder paste is used within its validity period, taking appropriate component transfer protection measures, and regularly maintaining and inspecting the SMT machine, the risk of component displacement can be effectively reduced and improvedSMTThe product quality of surface mount technology (SMT) processing

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