Quality inspection of solder joints in SMT assembly

In today's electronic product market, the development of various common electronic devices in life towards miniaturization and precision is an unstoppable trend. inSMTThe quality of solder joints in surface mount technology (SMT) processing can have a significant impact. Therefore, in order to ensure quality, many tests will definitely be carried out. Now, JJYSolder paste manufacturerLet me tell you all:

1. Solder pasteSMTQuality inspection of solder joints after surface mount processing:

1The surface gloss of the weld points must meet the production requirements and there should be no defect phenomena.

2The aspect ratio of the components should be moderate, moderatesmtThe amount of welding material and the welding material must completely cover the welding positions of the solder pads and lead wires.

3It should have excellent wettability. The edge of the welding point should be relatively thin, and the wetting Angle between the welding material and the surface layer of the pad is recommended300Below the degree, do not exceed the maximum600Degree.

Ii. Solder pasteSMTAppearance inspection after surface mount processing:

1There must be no phenomenon of missing components.

2There must be no phenomenon of incorrect component placement.

3There must be no short circuit phenomenon on the circuit board.

4There must be no adverse phenomena such as false welding or unstable welding.

As a 15-year-old veteran solder paste manufacturer, JJY has been dedicated to the research and development as well as production of solder paste for many years. The solder paste we produce is of stable quality, without solder connection, false soldering or monument erection. No residue, Wuxi beads, bright and full solder joints, firm solder joints, and excellent electrical conductivity. If you have any needs, please feel free to contact us.