What are printing and dispensing in SMT assembly?

SMTPrinting and dispensing in surface mount technology (SMT) processing are both important processing techniquesSMTIt plays an important role in the production process of processing, and printing and dispensing are among them. Many people might be thereSMTThe surface mount technology processing factory has heard of these two processing techniques. What are they? The following ShenzhenSolder paste manufacturerLet me briefly introduce the basic contents of printing and dispensing to you all:

PrintingSMTThe holes on the steel mesh for surface mount processing need to be determined based on the type of surface mount components, the performance and thickness of the circuit board, as well as the size and shape of the hole positions.

Dispensing: The principle of the dispensing process is to use compressed air to apply red glue onto the circuit board through the dispensing head. The control during the surface mount processing is carried out based on parameters such as size and quantity, time, and the diameter of the pressure tube. In actual processing, since the dispensing machine can use different glue heads and different parameter configurations for different parts to change, and can also change the shape and quantity of glue dots to achieve the desired processing effect, its advantages are quite prominent, namely convenience, flexibility and stability. Of course, there are also drawbacks. One of them is that wire drawing and bubbles are prone to occur during surface mount technology (SMT) processing. However, these drawbacks can be reduced. For instance, by adjusting operation parameters, speed, time, air pressure and temperature, etc., the issue can be effectively addressedSMTThe defects of surface mount dispensing have been minimized.

SMTThe size and volume of the surface mount components used in surface mount processing are much smaller than those of traditional through-holes and can generally be reduced60%-70%or90%The weight has been reduced60%-90%. This can directly meet the development demands of modern electronic products towards miniaturization and precision. Only those that conform to the development trend are good.SMTThe processing components for contract manufacturing are usually lead-free or have short leads, which can reduce the distributed parameters of the circuit and thereby decrease radio frequency interference.

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