What are the reasons for the displacement of components in SMT assembly?

inSMTIn the process of surface mount technology (SMT) production and processing, it is a common problem that components shift after being placed. With the continuous advancement of technology and the increasing demand for electronic products from people, the traditionalDIPPlugins can no longer meet the requirements of being small and compactPCBAThe demand for boards, especially in large-scale and highly integrated applicationsICIn production. Therefore,SMTSurface mount technology has been widely applied. However, inSMTIn surface mount technology (SMT) production, the occurrence of problems such as component displacement has affected the quality and efficiency of production. So, what are the reasons for the displacement of components in surface mount technology (SMT) processing? Below is Shenzhen JJYSolder paste manufacturerLet's explain.:

1Improper setting of the air pressure at the suction nozzle of the surface mount technology (SMT) machine: If the air pressure at the suction nozzle is insufficient, it will cause the components to shift.

2Excessive flux content: During the reflow soldering process, too much flux can cause components to shift.

3Insufficient viscosity of solder paste: The oscillation and shaking generated when components are moving can cause the components to shift.

4Excessive use of solder paste: The flux in the solder paste will deteriorate, resulting in poor surface mount soldering and component displacement.

5The components areSMTDuring the movement process after printing and mounting, if the components are shaken or the transfer method is improper, it can also cause the components to shift.

6Mechanical failure of the surface mount technology (SMT) machine: If the SMT machine experiences mechanical failure, it will lead to inaccurate placement of components, thereby causing the components to shift.

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