How to solve the bridging problem in Smt solder paste patch processing

As the volume of the product becomes smallerpcbaThe circuit board is more compact.smtMore and more surface mount technology (SMT) processing factories are facing the problem of precise soldering. For instance, bridging. A common defect is that when the solder flows directly on the connector during high-temperature soldering, it causes bridging. Bridge connections may occur insmtDifferent stages of the processing procedure. Now, by Shenzhen JJYSolder paste manufacturerThe reasons for the bridge connection are as follows:

1,PCBDesign issue:PCBPlace the larger and heavier components on the same side to makePCBUneven weight distribution occurs, causing tilting.

2The orientation of the components is reversed.

3The space between the gaskets lacks redundancy.

4The temperature curve setting of the reflow soldering furnace is not scientific.

5Unreasonable setting of surface mount pressure, etc.

So, after the above problems occur, how can they be solved? The following are some practical tips for reducing solder bridging:

1,pcbPrinted circuit board design

At the project initiation site, strictly carry out scientific planning at the circuit board design level, reasonably allocate the weight of components on both sides, the reasonable distribution of vent holes and through holes, adjust the spacing of dense components, and appropriately add solder mask layers, etc.

2Reflow soldering furnace temperature curve.

inpcbaIn processing, literally speaking, when liquid solder melts, the solder at the end with a higher temperature has higher activity. If the reflow soldering temperature curve is not set reasonably, it will lead to the disorderly flow of solder paste and increase the probability of bridging.

3Select a solder paste inkjet printer.

The solder paste inkjet printer does not need to apply solder paste through a steel mesh, which will reduce the poor contact coating of solder paste caused by unscientific openings in the template, warping of the steel mesh, and detachment of the steel mesh.

4Control the amount of solder paste reasonably

Reasonably control the coating amount of solder paste to reduce the problems of excessive collapse and high fluidity caused by excessive solder paste.

5Set the solder mask layer reasonably

The correct setting of the solder mask layer is of great help in reducing the risk of solder bridging.

Although in the actual production process, it may not be possible to accurately control the precision of each step, it is necessary to choose a reliable and experienced partner that can control. Meanwhile, if you want to learn more about soldering, please continue to follow JJY Solder Paste Factory and leave a message online to interact with us.