What are the causes of solder paste pilling? Let's briefly discuss.

Solder pasteisSMTOne of the most important welding wire materials in the patch. Solder paste manufacturers are also a new type of electric soldering material. WithSMTIt was born with the development of patch technology. It is a mud-like compound composed of a mixture of welding wire powder, flux paste, surfactant, thixotropic agent, etc.

Mainly used inSMTIndustry fieldPCBSurface resistivity, capacitorICElectric welding of electronic components, etc. However, during the printing process of solder paste, improper operation methods can produce solder balls. So, what are the main causes of solder paste pilling? Let's have the solder paste manufacturer explain it to you:

During the printing process, the thawing time is relatively short, organic solvents are evaporated, and then the solder paste turns into powder and falls onto the ink. The temperature of the soldering furnace is high, causing boiling over. The environmental humidity is relatively large, and dehumidification is necessary. If not carried out to avoid solder bead removal, there are too many small particles, the solder paste is oxidized and absorbs excess moisture, uneven heating, fast scraping speed, and deviations in the specific printing position, etc.

Generally speaking, the selection of solder paste is a rather important step. Choosing good solder paste and a solder paste distributor can reduce many of your troubles.

Shenzhen JJY Factory offers lead-free solder paste, halogen-free solder paste, lead-free solder wire, rosin solder wire, solid solder wire, lead-free solder bars and other soldering products. We also provide knowledge and question analysis on soldering for everyone. If you have any needs or more technical questions about soldering, you can follow JJY Solder Paste Factory and leave a message online to interact with us.