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What are the reasons for the unsmooth lead-free solder paste after soldering? Let's briefly discuss.

Return to List source: JJY Release Date: 2022.12.30

After soldering with lead-free solder paste, you may find that the circuit board after soldering is not as smooth as you imagined and is granular. What is the reason for this? Today, the solder paste manufacturer will talk about the main reasons why lead-free solder paste is not smooth after soldering:

Lead-free solder paste

The main reasons for lead-free solder paste not being smooth after soldering are basically divided into three types:

1The solder paste was preheated for too long, causing the flux to evaporate. As a result, the solder paste was oxidized by the air before it completely melted. Consequently, the soldered product will produce particles and be not smooth. Therefore, the preheating time needs to be significantly shortened, generally not exceeding120S.

2Electronic components have not been cleaned thoroughly, leaving residues. Do not come into close contact with them during solder paste soldering processingpcbThe circuit board has protrusions, resulting in an uneven finish after soldering.

3The solder paste is too dry. When the solder paste is dry, the overall effect of the soldering process is also not good and will be granular. Therefore, try to ensure the wettability of the solder paste as much as possible.

The above is all aboutLead-free solder pasteThe knowledge of welding processing, I hope it can be helpful to you. JJY is a company that conducts mutually beneficial cooperation with electronic raw material manufacturers. Meanwhile, it also produces welding wires, welding rods, solder paste and flux paste for other enterprises. We have a rich variety of successful cases in the research and development of chemical raw materials, and our overall strength builds a high-quality and trustworthy sales market.

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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RQ-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:190±20Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle
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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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