Analysis of the Causes of Undesirable Phenomena in SMT Assembly by JJY

During the production processSMTSometimes, some undesirable phenomena may occur in the surface mount, such as solder balls(Tin bead)Monument erection, short circuit, offset, tin explosion, insufficient tin, etc., these are all the "real culprits" that cause defective products! Next, Jia JinyuanSolder paste manufacturerFor the above several typessmtAnalysis of common adverse phenomena and causes:

The reason for the occurrence of tin frying is usually due toPCBCaused by moisture, during the welding process, in a high-temperature statePCBAfter coming into contact with solder, the phenomenon of tin explosion often occurs. To solve this problem,SMTA surface mount technology (SMT) processing factory can be located atPCBDuring the storage process, vacuum packaging is used, or baking is carried out before starting production and processing.PCBThe time for baking components on the board needs to be set according to the actual situation.

Apart from moisture, the incorrect use of flux is also one of the reasons for the occurrence of solder soldering. This includes excessive use of flux, moisture absorption of flux, and abnormal composition ratios, all of which can lead to itSMTPoor processing occurred in the surface mount technology (SMT) processing. To avoid these poor processing phenomena caused by improper use of flux, some points also need to be noted, such as sealed storage of solder paste, selection of solder paste with appropriate flux, and strict control of flux composition, etc.

As a 15-year-old veteran solder paste manufacturer, JJY has been committed to the research and development, production and sales of solder paste. Our product quality is stable, with no solder connection, no false soldering, and no monument erection. No residue, Wuxi beads, bright, full, firm solder joints with excellent electrical conductivity. If you have any needs, please feel free to contact us.