【 JJY 】 Three Methods to Remove Solder Paste in SMT Assembly

inSMTSurface mount printingSolder pasteAt that time, low-viscosity solder paste can cause printing defects. Excessive solder paste deposition can lead tosmtDefects and bridging may occur during printing, so the viscosity of the solder paste should be moderate. The working temperature of the printing machine and the speed of the squeegee will also affect the viscosity of the solder paste during use. For high-density pitch steel mesh, if the cross-section of the thin steel mesh bends, causing damage between the pins, solder paste will also deposit between the pins, resulting in printing defects. In conclusion, if there issmtDuring the surface mount technology (SMT) process, if the use of materials is not well controlled and the deposition of solder paste is not properly handled, problems will arise in the subsequent reflow soldering process. Next, JJY solder Paste Manufacturer will explain itSMTThree methods for removing solder paste in surface mount technology (SMT) processing:

1Although a small scraper was used to scrape, the solder paste was directly misprinted from the defective onesPCBIt can be directly removed from the board, but there are some drawbacks to doing so. It is easy to damage the circuit board. Generally speaking, a better method is to immerse the defective or misprinted board in a compatible solvent, such as some kind of water with additives, or board cleaning water, and then use a soft-bristled brush to remove the solder paste from the board. It is better to soak and scrub repeatedly than to dry brush or scrape vigorously. After the solder paste is printed and defects or misprints are found, the operator may need to wait for cleaning. The longer the waiting time, the more difficult it is to remove the solder paste. Defective or misprinted boards should be soaked in the solvent immediately after the problem is found. This is because the solder paste can be easily removed before it dries.

2When flushing, use a gentle spray to rinse. Do not wipe with a cloth to prevent solder paste and other contaminants from adhering to the surface of the board. After soaking, it can help remove unwanted solder paste.

3It is recommended to use hot air drying.

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