NowtmSolderpasteisusedinallindustries.Differentelectronicsrequiredifferenttypesofsolderpaste.Currently,low-temperaturesolderpasteiswidelyused.So,whatislow-temperaturesolderpaste?Meltingpoint138℃Thesolderpasteiscalledlow-temperaturesolderpastewhenthesurfacemountcomponentscannotwithstandit138℃Whenthetemperatureisaboveandthesurfacemountreflowprocessisrequired,usinglow-temperaturesolderpasteforthesolderingprocessservestoprotectthecomponentsthatcannotwithstandhigh-temperaturereflowsolderingPCBVerymuch.LEDTheindustrywelcomesitsalloycomposition......
Whataretheadvantagesoflow-temperaturelead-freesolderpaste?Generally,thiskindcontainsbismuthBiIt'sabitmorebrittle,madeofaluminumsubstrateLEDHigh-powerlampsmostlyuselow-temperaturesolderpaste,withameltingpointof138Productsthatarenotresistanttohightemperaturescanonlyuselow-temperaturesolderpaste,butthesolderingperformanceoflow-temperaturesolderpasteisnotasgoodasthatofhigh-temperaturesolderpaste.Themainreasonfortheapplicationoflow-temperaturesolderpasteisthattheproductdesigncannotwithstandconventionaltemperaturerequirements,suchasLEDorCOM1thePCB..Low-temperaturesolderpastealsohasitsadvantagesanddisadvantages:Disadvantage:Thelow-temperaturesolderpasteisS-BiAlloy,solderjointcapacity......
Whywaslow-temperaturelead-freesolderpastedeveloped?Generallyspeaking,lead-freelow-temperaturesolderpasteissuitableforSMTLead-freeelectronicproductswitharelativelylowbasematerialheatresistancetemperatureandlowrequirementsforfatigueresistancestrengthSMT"制程"可以翻译为"manufacturingprocess",Low-temperaturelead-freesolderpaste,itscompositionistinandbismuth.Themeltingpointofsolderinlow-temperaturelead-freesolderpasteis138℃Thepeakvalueofreflowsolderingis170-200℃Between.Low-temperaturelead-freesolderpastehasexcellentprintability,caneffectivelyremovelumpsanddepressionsduringtheprintingprocess,hasexcellentwettability,andthesolderjointsarebrightandround......
Whatislow-temperaturelead-freesolderpaste?GenerallyapplicabletoSMTLead-freeelectronicproductswitharelativelylowbasematerialheatresistancetemperatureandlowrequirementsforfatigueresistancestrengthSMTProcess.Lead-freesolderpasteisnowwidelyusedSAC305Itsmeltingpointis217°CButS64Bi35Ag1Themeltingpointofisonly178°CAndS42Bi58Itsmeltingpointisevenlowertoonly138°CThatistosay,itcontainsbismuthBiThemeltingtemperatureofsolderpasteisrelativelyhighSAC305Thelead-freesolderpasteislow39°C～79°CLeftandright,nowit'sfromJJYSolderPasteFactory......
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