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What are the advantages and disadvantages of low-temperature lead-free solder paste?

Return to List source: JJY Release Date: 2021.11.04

Low-temperature lead-free solder pasteWhat are its advantages? Generally, this kind contains bismuthBiIt's a bit more brittle, made of aluminum substrateLEDHigh-power lamps mostly use low-temperature solder paste, with a melting point of138Products that are not resistant to high temperatures can only use low-temperature solder paste, but the soldering performance of low-temperature solder paste is not as good as that of high-temperature solder paste. The main reason for the application of low-temperature solder paste is that the product design cannot withstand conventional temperature requirements, such asLEDorCOM1thePCB. .

Low-temperature solder paste also has its advantages and disadvantages:

Disadvantage: The low-temperature solder paste isSn-BiAlloys and solder joints are prone to brittle cracking and are not suitable for products with general strength requirements. In addition, when using low-temperature solder paste, components are prone to falling off. Especially for connector products that need to be plugged and unplugged during assembly, they are very likely to fall off. 

Advantages: Low-temperature solder paste is relatively cheaper than medium-temperature and high-temperature solder paste because it contains silver, which can reduce costs. Also because of the melting point of low-temperature solder paste138When the temperature of the furnace decreases, the energy consumption will also be reduced..


Low-temperature lead-free solder paste

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LFP-JJY5RQ-305T4 halogen-free and lead-free high-temperature solder paste

Brand:JIAJINYUAN/JJY Model:LFP-JJY5RQ-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:190±20Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle
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LFP-JJY5RNTT-305T4 halogen-free and lead-free high-temperature solder paste

Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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