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Why was low-temperature lead-free solder paste developed? JJY Solder Paste Manufacturer

Return to List source: JJY Release Date: 2021.10.16

Low-temperature lead-free tinWhy was ointment developed? Generally speaking, lead-free low-temperature solder paste is suitable forSMTLead-free electronic products with a relatively low base material heat resistance temperature and low requirements for fatigue resistance strengthSMT"制程" 可 以 翻 译 为 "manufacturing process",Low-temperature lead-free solder paste, its composition is tin and bismuth. The melting point of solder in low-temperature lead-free solder paste is138℃The peak value of reflow soldering is170-200℃Between. Low-temperature lead-free solder paste has excellent printability, can effectively remove lumps and depressions during the printing process, has excellent wettability, and the solder joints are bright and round. Moreover, its steel mesh printing has a long service life and strong adhesion, which fully meets the requirementsRoHSStandard.

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Product features of lead-free low-temperature solder paste:

1It has good wettability, is not easy to dry, has a long printing service life, stable effect, and more effectively ensures the bonding quality.

2It is easy to operate, with good printing rolling and tin dropping properties. Only a very low squeegee pressure is required. The printing performance is stable. During continuous printing, the viscosity change is extremely small, there is no collapse, and the surface mount components will not shift. The requirement is as low as0.3mmThe pitch pads can also achieve exquisite printing.

3It has higher welding performance and can be used for nickel-plated platesPCBVarious manufacturing processes such as plate, hot air, and infrared reflow welding. 

4There is very little residue after welding, and it has a relatively high insulation resistance. It won't11CorrosionPCBThe board surface is clean and fully meets the requirement of being washable.

5It can be used in the coating process of through-hole rollers.

6Incorporating the latest demolding technology, the operation process reduces the number of times the screen is wiped, thereby enhancing work efficiency.

7The weld points are full, uniform and have climbing characteristics.

8It features high surface insulation impedance and no internal circuit testing issues.

9The alloy composition contains42%Bismuth, brittleness is a property of metallic bismuth, so low fatigue strength is a defect of lead-free low-temperature solder paste. 

 Want to know about solder pasteLead-free solder pasteFor any soldering issues such as solder paste, we welcome partners to consult Shenzhen JJY Industrial Technology Co., LTD. Let's learn and grow together! The solder wire, solder paste and solder rods of JJY brand are always waiting for partners to come and take them together.

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LFP-JJY5RQ-305T4 halogen-free and lead-free high-temperature solder paste

Brand:JIAJINYUAN/JJY Model:LFP-JJY5RQ-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:190±20Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle
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LFP-JJY5RNTT-305T4 halogen-free and lead-free high-temperature solder paste

Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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