Soldering Technology, Tin Leads The FutureOne Stop Electronic Tin Soldering Solution Supplier
Brand:JIAJINYUAN/JJY
Scope of applicationApplicable to mobile phonesPCB,BGAandPGASuch asSMDThe repair flux paste
Viscosity:200(Pa·S)
Activity:Weak activity
Specification:100g/bottle
Lead-free solder paste is developed using special solder flux and spherical tin powder with very low oxide content, and adopts a conformingRosin Mildly Activated Classification of Federal specificationThe required non-halogen activation system This solder paste isRMAFlux and tin powder particles are uniformly mixed. The solder paste contained in this product complies with the standards of the United StatesQQ-571As stipulated in itRMAType and passSGSTest compliantRoHSInstruction requirements.
The on-time delivery rate is as high as99%
Applicable to wireless network cardsDVDMid-to-high-end electronic products such as mobile phones, refrigerators, air conditioners, high-frequency heads, security products, and computersSMT"制程" 可 以 翻 译 为 "manufacturing process"
| Project | Parameters | |
| Appearance | The appearance is light gray, smooth and paste-like without layering | |
| Flux content(wt%) | 11±0.5 | |
| Halogen content(wt%) | RMAtype | |
| Viscosity(25℃whenpa.s) | 200(±10%) | |
| Particle volume(μm) | 25~45 | |
| The water jet takes impedance(Ω·cm) | >1×105 | |
| Silver tinate paper test | Qualified | |
| Copper plate corrosion test | Qualified | |
| Surface insulation impedance test(Ω) | 40℃/90%RH | >1×1013 |
| 80℃/85%RH | >1×1012 | |
| Expansion rate(%) | >90 | |
| Tin bead test | Qualified | |
| Note: The test method is applicableJIS.Z.3282andANSI/J-STD-006 |
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in5-10℃The storage period under the environment is6Months, not less than0℃Store under such conditions and thaw before use2-4It should be left to room temperature for more than an hour before opening to prevent the formation of tin beads due to moisture. Then stir well before use.
