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Lead-Free Solder Paste
Rfp-jjy5rw-305t4 water-washable lead-free high-temperature solder paste

Brand:JIAJINYUAN/JJY

Model:LFP-JJY5RW-305T4

Alloy composition:Sn96.5Ag3.0Cu0.5

Particle size:4#(20-38um)

Viscosity:160±20Pa.S

Activity:Weak activity

Melting point:217℃

Working temperature:240-255(℃)

Specification:500g/bottle

Product Description product description
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LFP-JJY5RW-305T4Water-soluble water-washable lead-free high-temperature solder paste is adoptedSn96.5Ag3.0Cu0.5It is made of spherical solder powder of lead-free tin alloy with low oxidation degree and has excellent environmental protection characteristics,At the same time, it is a water-soluble water-washing paste refined from imported chemical materials, which is suitable for the soldering production process of electronic components with high cleanliness requirements. The coffee-colored residue after welding can be dissolved and washed off with pure water (deionized water), but it does not change after cleaningLeaving any residue can achieve excellent resultsICTTest the performance without causing damage to electronic components. The production and cleaning processes do not cause pollution and meet environmental protection requirements. It has a fast cleaning speed, much faster than other types of solder paste. It has good demolding performance during printing, excellent dry resistance and good thixotropic performance, and can be applied to general spacings≧0.3mmThe printing of pads and the mounting of most components. When printing continuously, the viscosity change is small, which can ensure the stability of the printing effect during long-term operation. This product has excellent thixotropic performance and maintains a good shape after printing,It is not easy to collapse and avoids the displacement of surface mount components. The weld points are bright after welding and have excellent electrical conductivity. Fewer solder beads are produced during welding, reducing the occurrence of short circuits.

On-time deliveryThe on-time delivery rate is as high as99%
Scope of application Scope of application
Wide range It is suitable for electronic components with high cleanliness requirementsSMTThe production process of surface mount soldering. The coffee-colored residue after welding can be dissolved and washed off with pure water (deionized water). After cleaning, no residue is left, which can achieve an excellent effectICTTest the performance without causing damage to electronic components. The production and cleaning processes do not cause pollution and meet environmental protection requirements. It has a fast cleaning speed, much faster than other types of solder paste.

Technical parameters

Technical Parameters

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Product display Product Show


Water-washed lead-free high-temperature solder paste


Product Features Product characteristic
  • 1 It can be washed with water and has a high degree of cleanliness The residues after welding can be dissolved and washed away with pure water (deionized water). After cleaning, no residue is left, and the cleanliness is very high, reaching an excellent levelICTTest the performance without causing damage to electronic components. The production and cleaning processes do not cause pollution and meet environmental protection requirements. It has a fast cleaning speed, much faster than other types of solder paste.
  • 2 The weld points are firm, bright and full 15With years of R&D and production experience, we have scientifically mastered modern process formulas, ensuring that the solder paste is highly compatible with the soldered products. The solder joints are firm, bright, uniform, full and free of solder beads.
  • 3 It has strong wettability and good tin crawling High-performance thixotropic agents are added to the solder, making the solder paste highly active. The molten solder paste significantly wets the solder pad, reducing the phenomenon of false soldering during the soldering process.
  • 4 The printing is stable and has good demolding properties The tin powder particles have good roundness and uniform size. During printing, there is no trailing, sticking or splashing phenomenon. There is no collapse, sharp or continuous tin connection during molding. The viscosity change is small during continuous printing, and it does not dry out. The components do not shift.
Instructions for Use Instructions for use
Instructions for Use in2-10℃The storage period under the environment is6Months, not less than0℃Store under such conditions and thaw before use2-4It should be left to room temperature for more than an hour before opening to prevent the formation of tin beads due to moisture. Then stir well before use.
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