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Lead-Free Solder Paste
LFP-H-03 lead-free solder paste

Brand:JIAJINYUAN/JJY

Model:LFP-H-03

Alloy composition:Sn64.7Bi351.0Ag0.3

Particle size:25-45(um)

Viscosity:200(Pa·S)

Activity:Weak activity

Melting point:217℃

Working temperature:235-250(℃)

Specification:500g/bottle

Product Description product description
LFP-H-03

Lead-free solder pasteLFP-H-03It is developed by using special flux and spherical tin powder with very low oxide content, and adopts a conformingRosin Mildly Activated Classification of Federal specificationThe required non-halogen activation system This solder paste isRMAFlux and tin powder particles are uniformly mixed. The solder paste contained in this product complies with the standards of the United StatesQQ-571As stipulated in itRMAType and passSGSTest compliantRoHSInstruction requirements.

On-time deliveryThe on-time delivery rate is as high as99%
Consult immediately
Scope of application Scope of application
Wide range Applicable to wireless network cardsDVDMid-to-high-end electronic products such as mobile phones, refrigerators, air conditioners, high-frequency heads, security products, and computersSMT"制程" 可 以 翻 译 为 "manufacturing process"
Technical parameters Technical Parameters
Project Parameters
Appearance The appearance is light gray, smooth and paste-like without layering
Flux content(wt%) 11±0.5
Halogen content(wt%) RMAtype
Viscosity(25℃whenpa.s) 200(±10%)
Particle volume(μm) 25~45
The water jet takes impedance(Ω·cm) >1×105
Silver tinate paper test Qualified
Copper plate corrosion test Qualified
Surface insulation impedance test(Ω) 40℃/90%RH >1×1013
80℃/85%RH >1×1012
Expansion rate(%) >90
Tin bead test Qualified

Note: The test method is applicableJIS.Z.3282andANSI/J-STD-006
Composition of tin powder alloyJIS.Z.3910
The performance Pointers listed in this table are reference values, and the actual values are from each batch of deliveryQAThe report shall prevail.

Product display Product Show

LFP-H-03Lead-free solder paste

LFP-H-03Lead-free solder paste

Product Features Product characteristic
  • 1 The weld points are firm, bright and full 12With years of R&D and production experience, we have scientifically mastered modern process formulas, ensuring that the solder paste is highly compatible with the soldered products. The solder joints are firm, bright, uniform, full and free of solder beads.
  • 2Low residue, no need for cleaning We have developed and formulated a no-wash environmentally friendly flux, which leaves little residue after welding, has high insulation resistance, a clean board surface without corrosion, and forms a protective layer to prevent the substrate from oxidizing again.
  • 3 It has strong wettability and good tin crawling High-performance thixotropic agents are added to the solder, making the solder paste highly active. The molten solder paste significantly wets the solder pad, reducing the phenomenon of false soldering during the soldering process.
  • 4 The printing is stable and has good demolding properties The tin powder particles have good roundness and uniform size. During printing, there is no trailing, sticking or splashing phenomenon. There is no collapse, sharp or continuous tin connection during molding. The viscosity change is small during continuous printing, and it does not dry out. The components do not shift.
Instructions for Use Instructions for use
Instructions for Use in5-10℃The storage period under the environment is6Months, not less than0℃Store under such conditions and thaw before use2-4It should be left to room temperature for more than an hour before opening to prevent the formation of tin beads due to moisture. Then stir well before use.
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