Lead-free solder pasteHow to solve printing defects that occur during printing? Generally, when we are printing solder paste, some printing defects are prone to occur, which leads to production stagnation and is very troublesome. Therefore, everyone must strictly follow the production and manufacturing process steps. If any problems are found, the cause must be immediately identified and the corresponding solution found. JJY solder Paste Manufacturer would like to explain to you:

1. Incomplete printing

Incomplete printing refers to the situation where there are some areas on the solder pads that are not printed with solder paste during the printing process. The reasons for its occurrence are:

1The holes opened on the solder pads are blocked or there is some solder paste stuck to the bottom of the template.

2The solder paste used has a relatively low viscosity.

3The metal powder particles contained in the solder paste are relatively large.

4The scraper of the production equipment wears out relatively severely.

Preventive solutions:

Clean the holes and the bottom of the template thoroughly. When using solder paste, choose a solder paste with a suitable viscosity to effectively cover the entire printing area;The particle size of the selected metal powder should correspond to the size of the holes opened in the template;Check and replace the scraper.

Ii. Pull out the tip

Sticking refers to the phenomenon where the solder paste on the solder pad appears as small peaks after printing. The possible causes may be the gap between the squeegee or excessive viscosity of the solder paste.

Prevention or solution: Make appropriate adjustments to the gap of the scraper or select solder paste with a relatively suitable viscosity.

Iii. Collapse

After the solder paste is printed, it collapses towards both sides of the solder pad. The possible reasons for its generation might be:

1The pressure of the scraper is relatively high during the production process.

2The printed circuit board was not accurately positioned during the positioning process.

3The viscosity of the solder paste or the metal content is too low.

Prevention or solution:

Adjust the pressure of the scraper properly;The printed circuit board needs to be re-fixed;Choose solder paste with a relatively appropriate viscosity.

Iv. The solder paste is too thin

The possible reasons for its generation might be:

1The printed template is relatively thin.

2The pressure of the scraper is too high during the production process.

3The solder paste has poor fluidity during use.

When choosing lead-free solder paste, please give priority to those with guaranteed after-sales serviceR&DSupplier of the laboratory. When taking samples, you can identify problems and make adjustments, and then place an order. If you want to know more about solder paste, solder paste, low-temperature solder paste, solder wire, and solder bar, welcome to consult Shenzhen JJY Industrial Technology Co., LTD. Let's learn and grow together!