How to choose in the electronic processing and manufacturing industrySolder paste? In our electronic processing and manufacturing, solder paste is frequently encountered and used, but it is often difficult to select the most suitable solder paste based on different product requirements and characteristics. There are many factors that affect the quality of solder paste printing, such as the manufacturing process of steel mesh and the design of steel mesh openings.PCBFlatness, printing parameter Settings, characteristics of solder paste itself, etc. So how should we choose a better one? Let's have JJY solder Paste Manufacturer explain it to you below:

At present, due to environmental protection requirements, lead-free products are mostly adopted. However, since lead-free products are more expensive than lead, generally speaking, it is necessary to check whether the company's products need certification and whether they need to be applied in special markets. If not, most people can choose lead.

1. Consider the number of reflow ovens andPCBTemperature requirements for components: high, medium and low-temperature solder paste.

2. According toPCBThe requirements for cleanliness and different cleaning processes after reflow soldering are selected: - When adopting the no-cleaning process, no-cleaning solder paste that does not contain halogens and strong corrosive compounds should be selected. - When the solvent cleaning process is adopted, solvent-cleaning solder paste should be selected. - When the water cleaning process is adopted, water-soluble solder paste should be selected. - BGA,CSP Generally, high-quality no-clean silver-containing solder paste needs to be selected.

3According toPCBSelect the activity of solder paste based on the storage time of components and the degree of surface oxidation: - Generally adoptedKJRMAGrade; - High-reliability products, aerospace and military products are available for selectionRGrade; - PCBComponents that have been stored for a long time and have severely oxidized surfaces should be adoptedRAGrade, post-weld cleaning;

4According toSMTThe assembly density(Is there a narrow spacing?)To select the particle size of alloy powder, the particle size of commonly used solder paste alloy powder is divided into four particle size grades(2,3,4,5Followers)It is generally chosen when the spacing is narrow20-45um;

5The viscosity of the solder paste should be selected based on the process of applying the solder paste and the assembly density. High-density printing requires a high viscosity, while drop coating requires a low viscosity.

6Select according to environmental protection requirements. For lead-free processes, solder paste containing lead cannot be selected.

Therefore, no viewpoint is completely absolute. Only by choosing the right one that suits you can it be considered good! Shenzhen JJY Industrial Technology Co., Ltd. mainly operates:LEDType solder pasteThere is lead solder pasteLead-containing silver solder paste, stainless steel plate type solder pasteSMTSolder paste and wire manufacturers of type solder paste, lead-free flux paste, no-clean solder wire, lead-free solder wire, leaded solder wire, lead-free and leaded solder rods, wave solder rods, automatic solder wires, etc.