Lead-free solder pasteWhat are the methods for performance evaluation? The contemporary electronics industry is developing rapidly. The soldering of flux paste for digital products is its main manufacturing stage. At present, semiconductor components that operate at high temperatures, especially power devices, are involvedledFor packaging, high-density integrated circuit packaging, and the assembly of some high-precision and dense integrated circuits, the second or even the third reflow soldering process must be carried out using high-lead solder paste for soldering. However, lead and other chemical substances have a huge impact on the human body and cause significant environmental pollution to the natural environment.

1All the repeated matters in a set of standard tests need to be recorded in detail to facilitate the identification of which can be attributed to the performance of the solder paste. At this time, the usage and consumption can also be recorded. If it is highly possible, the conditions of the processing plant during the standard test should also be recorded, such as temperature, environmental humidity, operator, production batch number of the board, solder paste, and even components. One should be chosen.'Well.'Mass production: A typical production and manufacturing condition that is large enough to be more meaningful for statistical analysis(If more50But lower than500).

2Standard test the current performance of solder paste. Test these key characteristics that can harm the visual effect and electrical equipment at one time according to the pass rate. To achieve better accuracy and masculinization of the equipment, this test is preferably conducted both on and off the test physical model. The function tests include: the properties of self-adhesive label paper, slump shape, adhesion and adhesive service life, weldability, residual level and cleanability(If possible).
    Obtain a specific report on the pass rate of the test. Indicate the unique reasons for the rework of components. For each issue, the cause should be identified, such as insufficient solder wire, lead, solder bridge, nameplate, difference in melting moisture, misaligned pins, incorrect placement of components, and lost components, etc. Because the performance of raw materials nowadays is measured based on specific function tests and pass rate damage, it is also a good situation to analyze the corresponding necessity of the key performance type of this solder paste for customer installation.
       3When the qualification rate of new materials can be confirmed and/When the production and sales volume increase, the second batch of goods should be produced and manufactured as closely as possible to the same standards as in Process Two. If the conditions vary too much, the same number of boards should be produced using the current solder paste. The key point is: In order to better and more accurately assess the actual effect of raw material transformation, all the shortcomings must be fully recorded.

4The testing of the new material is carried out in Process One under the same standards and methods for calibrating the current solder paste. Subsequently, the assessment results showed that all these raw materials with poorer performance were not on the list. In fact, some balances in performance should be noted and the customer Settings of performance expectations obtained from Process Two should be applied.

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