It is believed that many electronics factories have in the welding processLead-free and environmentally friendly tin barsWave soldering may produce some tin droplet, which is a normal situation. However, sometimes there may be excessive tin droplet. In such cases, it is important to pay attention to the issue. Generally, this situation can also lead to quality problems of the product and cause significant defects. At this time, it is necessary to analyze where the problem lies. Now, the solder paste manufacturer will explain it to you:

First of all, we should distinguish whether the tin slag that appears is normal tin slag. Generally speaking, tin slag that is in the form of black powder is normal in nature, while tin slag that is in the form of tofu residue is abnormal. In response to this situation, we have analyzed that the causes are as follows:

1In this case, a major cause is the problem with the wave soldering equipment - the wave soldering furnace. Currently, many wave soldering furnaces are not designed ideally, with high peaks, overly wide peak stations, double wave soldering furnaces placed too close to each other, and the use of rotary pumps inside the equipment. All these are possible reasons for the generation of problematic tin slag. If the wave peak is too high, during the process of the solder falling from the peak, the temperature drop deviation may increase. The solder will mix with air, causing oxidation or semi-dissolution of the solder, resulting in the formation of problem solder droplet. If the preventive measures for the rotary pump are not well implemented, it will continuously press tin slag into the furnace, and the chain reaction of the loop will aggravate the generation of problem tin slag.

2The temperature is too low. The temperature control for wave soldering is relatively low, generally280℃±5℃This temperature is the minimum temperature required for the solder melting process. If the temperature is any lower, the tin cannot be well melted, which indirectly leads to an excessive amount of tin slag.

3The most suitable time for adding tin was missed. In the wave soldering process, the timing of adding the tin strip is also very crucial. At the most appropriate time, the distance between the tin surface and the peak should always be kept as short as possible.

4One of the reasons for the problem is that the tin slag in the furnace was not cleaned in time or not cleaned frequently. If there is too much tin slag in the furnace, the solder that falls from the peak cannot be quickly dropped into the furnace but will remain on the tin slag, resulting in uneven heating and thus causing an excessive amount of tin slag.

5Is the peak furnace cleaned regularly? If the peak furnace is not cleaned for a long time, it will lead to a high content of impurities in the furnace, which will also cause excessive tin slag.

The above are some of the reasons I have shared with you. Regarding the excessive production of tofu-like tin slag mentioned above, I believe you should have a clear understanding. I hope it will be helpful to you. If you still have any questions, please feel free to consult me!