Everyone is well aware that wave soldering is the most widely used in the electronics industry, but the solder strips generally used in wave soldering are usuallyLead-free tin barLead-tin strips can also be used, but the tin content of the lead-tin strips needs to be sufficient50%As mentioned above, once the peak opens, the tin in the furnace will decrease. At this time, a higher peak frequency is needed to meet the production requirements. The higher the frequency of the wave soldering machine's jet flow, the more unstable the tin wave will be, and the greater the amount of tin slag produced. Therefore, the frequency of tin addition needs to be controlled and set according to the conditions of the product itself.2Hours or3Add once every hour to keep the tin liquid level at all times10-20mmThe peak parameters do not need major modifications, and the process stability is better. Now, the solder paste manufacturer will explain it to you:

What issues should be noted in the wave soldering process?
  1There is green oil in the component hole, resulting in poor tin plating inside the hole. The green oil in the hole should not exceed the wall of the hole10％The number of holes in the internal green oil should not exceed5％.
  2The thickness of the coating is insufficient, resulting in poor tin plating inside the holes.
  3The coating thickness on the wall of the component hole is insufficient, resulting in poor tin plating inside the hole. For example, the thickness of copper, the thickness of tin, the thickness of gold, etc. Generally, the thickness of the hole wall should be greater than18μm.
  4The hole wall is too rough, resulting in poor tin plating or false soldering inside the hole. If the hole wall is too rough, the coating will be uneven. If some coatings are too thin, it will affect the tinning effect.
  5The holes are damp, resulting in false welding or bubbles. Package when not dried or cooledPCBAs well as being left for a long time after unpacking, etc., all lead to dampness inside the holes, resulting in false soldering or bubbles.
  6The size of the pad is too small, resulting in poor welding.
  7The dirt inside the hole leads to poor welding.PCBInsufficient cleaning, such as the gold plate not being acid-washed, leads to the residue of impurities and dirt on the holes and gaskets, affecting the tin effect.
  8Due to the small size of the hole, the component could not be inserted into the hole, resulting in the failure of the welding.
  9Due to the offset of the positioning hole, the component could not be inserted into the hole, resulting in the failure of the welding. 

When it comes to the selection of solder bars for wave soldering, we can simply understand that the quality of the solder bars must be excellent. Generally, there are also certain requirements for the operator. Therefore, in this regard, everyone still needs to pay more attention to avoid improper operation leading to defective products. And now the market is becoming increasingly complex, and some requirements63If you have the tin bar, others will give it to you50The goods seemed to have a great bargain in terms of price, but in fact, they suffered a huge loss. As the saying goes, "One cent.jMoney is always worth it. Therefore, when choosing tin bars in the market, it is necessary to do more research and try to select products from regular manufacturers to provide certain guarantees.