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What are the requirements for the solder paste used in LED chips? Are the operations different?
source: JJY Release Date: 2023-07-27

NowadaysLEDIt is mostly adopted in the electronics industrySolder pasteCome for welding and packagingLEDA chip isLEDThe key to the electronics industry. What requirements does it have for the solder paste used? Are the operations different? Now, JJY solder Paste Manufacturer will explain it:

Solder paste

LEDChips are generally of fine-pitch or high-power type, which requires the solder paste powder used to have small particles, relatively low viscosity, high activity, good thixotropy, and be able to effectively provide the thermal conductivity required by relatively small devices. At the same time, it is also required to have good solderability, ease of operation, etc.

LEDDie bonding solder paste is generally used in the soldering between metals, and its electrical conductivity is also relatively good during the application process. According to relevant data and experimental results,LEDThe thermal resistance of the device is approximately greater than that of solder paste as the bonding material10KW,SAC305X and SAC305 The thermal conductivity of the alloy is 54W/M·K Left and right. During the usage process, high-temperature solder paste can serve as a bonding material, which should be of the power typeLEDIt's a good choice.

inLEDIn fields such as wafer installation, solder paste can replace some existing installation materials like conductive silver glue and thermal conductive glue, which can achieve better thermal conductivity and significantly reduce installation costs.

LedKey points for using die bonding solder paste

1Before use, place the die bonding solder paste at room temperature.25℃(Left and right), warming up 1-2 Hours. 

2When in use, it is essential to prevent water droplets from the outside of the container from seeping into the solder paste. The mixture of water vapor will affect its properties. 

3Solder paste is a solid substance and its surface is prone to drying due to solvent evaporation. Therefore, after opening the lid, it is recommended to minimize the exposure time to the air as much as possible. If the solder paste in the syringe cannot be used up completely at one time, please refrigerate the remaining solder paste in the syringe as required. 

4Die bonding equipment can be either a printing machine or a die bonding machine. The printing process is the same as that of silver glue. 

5According to the customer's usage habits and requirements, if the viscosity of the solder paste is relatively high, a dedicated diluent can be appropriately added to the solder paste in several portions, stirred evenly, and then solidified. Die bonding solder paste contains a very small amount of volatile solvents. If the viscosity of the solder paste increases due to an excessively long die bonding time, an appropriate diluent can be added, and it can be stirred evenly before die bonding.

JJY Solder Paste Manufacturer mainly engages in lead-free solder paste.SMTSurface mount solder pasteLEDThe research and development, production and supply of solder paste. For more knowledge about electronic soldering, you can follow and contact us. Welcome to interact with us.

edit: JJY

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