Solder paste manufacturerDuring packaging and printing, there are several types of solder paste quality issues: insufficient solder paste, solder paste stickiness, and overall deviation in packaging and printing. What factors cause these problems?Shenzhen JJYThe solder paste manufacturer explains:

    Solder pasteInsufficient: It will result in insufficient spot solder of components after electric soldering, leading of components, deviation and erection.

The key reasons are: the basic parameters of the equipment such as the working pressure, viewing Angle, speed and demolding speed of the solder paste scraper are not suitable. The fixed clamping of the circuit board inside the printing press is loose. Solder paste is missed on the screen board or there are air pollutants on the circuit board, or the thickness of the screen board is uneven. The solder paste was not replenished in time when the printing press was in operation. After the solder paste packaging and printing were carried out, it was accidentally knocked off by a human error. The unused solder paste has long expired and has been reused, etc.

    Solder paste adhesion: It will cause a shortage of power circuits and component deviations after electric soldering.

The key reasons are: the design of the circuit board has flaws, and the gap between the solder layers is too small; The perforated parts of the mesh plate are skewed, not cleaned thoroughly and the solder paste demolding is poor. The solder paste has poor properties, with poor viscosity and collapse. The basic parameters of the machine equipment such as the working pressure, viewing Angle, speed and demolding speed of the solder paste scraper are not suitable. After the solder paste packaging and printing were carried out, it was accidentally squeezed and formed by human error and stuck together.

    Overall deviation during solder paste packaging and printing: It will cause poor soldering of the entire plate of components, such as insufficient solder, lead, deviation, etc.

The key reasons are: the positioning standard of the circuit board is unclear, or it lacks symmetry with the standard of the grid board. The ejector pins of the mold were not positioned in time. Common faults of the electronic optical positioning system of the printing press; The solder paste missed printing and the perforation of the screen board are inconsistent with the design scheme document of the circuit board.

    Shenzhen JJY Industrial Technology Co., LTDMain business: Production of solder (solder wire, solder paste, solder bar, solder sheet, tin foil, etc.). AndLEDType solder paste, lead-containing solder paste, lead-containing silver solder paste, stainless steel plate type solder pasteSMTSolder paste, lead-free flux paste, no-clean solder wire, lead-free solder wire, leaded solder wire, lead-free and leaded solder stripsWave soldering rods, solder wires of automatic soldering machines.