How can the impact of solder paste splashing be minimized? -- JJY Solder Paste Manufacturer

How can the impact of solder paste splashing be minimized? Generally, in the production process of solder paste, waste is inevitable, which means issues related to the quality and reliability of the product as well as the manufacturing process. Other types include water stain contamination and flux splashing. These effects are relatively minor, but due to solder splashing, the solder has actually wetted the surface of the "gold finger". Now, let's take a look at Jia JinyuanSolder paste manufacturerLet me tell you all:

There are many reasons for solder spatter, and it is not necessarily the result of explosive venting from hot or molten solder during reflow soldering. Any method that may cause solder paste powder balls to deposit on the gold fingers and remain there during the reflux process can result in solder splashing. The reasons include: the bottom surface of the template was not wiped during the screen printing process(The template is dirty.); Improper cleaning methods after misprinting; Accidental handling during silk-screen printing Excessive moisture vapor in the machine plate material and contaminants; Extremely fast temperature rise slope(More than one second4℃).

In the subsequent reasons, the intense venting of the flux may cause small explosions in the molten solder joint, causing the solder particles to fly around in the air within the reflow chamber and splashPCBOn it, the "gold fingers" that contaminate the connector.PCBThe situation where moisture is trapped within the material is the same, and it has the same effect as the exhaust of flux. Similarly, external contamination on the surface of the board also causes tin splashing.

The impact of tin splashing: People are concerned that tin splashing may have harmful effects on the connector interface. Slight splashing of "tin blocks" can cause damage to the gold finger plane of the connector. These tin blocks are not flexible. Tin itself has poorer electrical conductivity than gold, especially after oxidation. The first and easiest way to eliminate solder splashing is during the screen printing process of the solder paste template. If this process is the cause of tin splashing, it can be controlled through good equipment management and maintenance, including appropriate screen printing machine Settings and operator training. If the cause is not here, then other aspects must be examined.

Solution for solder paste splashing:

Prevention: Avoid One way to deal with the accumulation of solder splashes is to apply a removable solder mask layer on the red gold finger, apply it after the screen printing ink solder paste, and remove it after reflow. This method has not been confirmed yet. It is very likely that the cost will increase. Due to the involvement of manual operations, the optional areas on the coating board will cause difficulties and eventually halt the production line operation. In addition, you can choose to stick temporary adhesive tape on the fiery red gold finger. This method also has the same defect.

Minimization: To better verify this and obtain the application of the expansion tank manufacturer, the standard solder paste system software is evaluated based on the assessment of the harm to the raw material and the rise of the reflux temperature curve. It is clearly stated that surfactants, organic solvents, aluminum alloys and reflux temperature curves have critical hazards to the tin splashing level. Therefore, having the confidence to tackle the difficulties, the reasonable adjustment of such basic parameters can minimize solder splashing.

The solder paste of Shenzhen JJY brand has gone through many years12A solder paste and wire manufacturer specializing in the annual research and development of solder paste, solder wire, solder wire, lead-free solder paste, leaded solder paste, solder rods, leaded solder paste, etc. Choose the solder paste of JJY brandSolder paste manufacturer.