What are the requirements for using solder paste in the installation of LED chips

inLEDIt is used on the chip installationSolder pasteIts adhesive performance can print fine spacing or install high power very wellLEDChip. This is specifically developed for ultra-fine pitch wafer soldering and can effectively provide the required thermal conductivity for smaller devices. The performance of solder paste also includes processability and versatility, featuring relatively small solder powder particles, relatively low alloy content, low viscosity, high activity and good thixotropy.

Solder paste is generally used for soldering between metals, and its electrical conductivity is also relatively good during use. According to relevant data and experimental results,LEDThe thermal resistance of the device is approximately greater than that of solder paste as the bonding material10K\W. During the usage process, high-temperature solder paste can be used as a bonding material, which should be of the power typeLEDIt's a good choice.

inLEDIn fields such as wafer installation, solder paste can replace some existing installation materials like conductive silver glue and thermal conductive glue, which can achieve better thermal conductivity and significantly reduce installation costs. Compared with conductive silver glue. JJYLEDInverted solder paste has the following characteristics:

1During the welding process, the fusion between metals can be achieved, forming an alloy with the welding surface of the device, which has excellent electrical conductivity and bonding performance.

2The thermal conductivity of tin is67W\m.kThe thermal conductivity of the alloy also varies depending on the metal. During the usage process, it can achieve a relatively ideal heat conduction effect and effectively reduce the interface thermal resistance.LEDDuring the installation process, conductive adhesives and thermal conductive gels are commonly used, generally as0.5W-2.5W\m.kThis leads to a very high thermal resistance at the interface;

3Using tin powder instead of silver powder greatly reduces the installation cost.

4According to the requirements of various processes, ultrafine solder paste can be printed on steel mesh and also used for dispensing. The operation time is relatively long and the performance is relatively stable.

5It has a relatively wide range of applications and can be used inLEDWafer soldering, flip-chip soldering and other ultra-fine pitch soldering.

The above is the introduction of JJY solder Paste ManufacturerLEDThe application of flip-chip solder paste. I hope the above description can bring you a new understanding of solder paste.