Nowadays, many people encounter a lot of welding slag during the welding process, but it is difficult to clean. They are not sure if it is a problem with the product itself. Generally, the flux (paste) cannot be completely volatilized during the welding process, and there will always be residues left on the board. Whether the residue needs to be cleaned and removed depends on the selectionFluxTaking into account various factors such as quality, product requirements, and production costs comprehensively, these are still the points that everyone needs to pay attention to. Now, let's talk about them together with the solder paste manufacturer's editor:
First of all, we need to understand the concepts of cleaning and no-cleaning. The so-called no-clean flux in the industry means that it does not need to be cleaned after the wave peak and will not cause electrical performance problems, rather than leaving no residue after soldering. Also, all friends who use fixtures should note that when using no-clean flux, residues should not accumulate together, as this can easily produce white residues, such as lead oxide or bromide, which are the products of the reaction between the flux and the solder. If you are making semi-finished products and the customer isPCBAIf no residue can be seen, then cleaning is necessary. During the cleaning process, it must be done thoroughly. The occurrence of conductive substances and the formation of white residues after cleaning are all caused by incomplete cleaning. The cleaning of washable fluxes can be roughly divided into the following two categories:
1. Manual cleaning
Use hand tools to clean the residual flux and dirt on the welding points. The manual cleaning method is suitable for all kinds of welding points. It is simple and has a good cleaning effect, but the efficiency is low. The commonly used tools for manual cleaning include writing brushes, brushes, tweezers, cotton yarn, etc. The following points should be noted when cleaning:
1Do not damage the soldering points or components. The cleaning action should be gentle. Do not twist or pull the wires on the soldering points or the leads of the components.
2The cleaning solution should not flow out. Do not use excessive cleaning solution to prevent it from flowing into the interior of the product and reducing its performance.
3When the cleaning solution becomes dirty, it should be replaced in time. Cleaning solutions are usually flammable chemicals. Fire prevention should be noted when using them.
Ii. Ultrasonic Cleaning
Ultrasonic cleaning is a method that uses the cleaning effect produced by the high-frequency oscillation of ultrasonic waves to complete the cleaning process. There are ultrasonic cleaning agents involved.
The completed cleaning method. The principle is as follows: Under the action of ultrasonic waves, the cleaning solution generates a cavitation effect. The high-intensity shock waves produced by the cavitation effect cause the dirt on the welding points and in the fine crevices to detach off, and can also accelerate the process of the cleaning solution dissolving these dirt. The characteristics of ultrasonic cleaning method are: fast cleaning speed, good cleaning quality, capable of cleaning complex welded parts and dirt in crevices, and easy to achieve cleaning automation. The effect of ultrasonic cleaning is related to many factors, mainly including the frequency and intensity of ultrasonic waves, the nature of the cleaning solution, temperature and cleaning time, etc.
A lot of inquiriesSolder paste manufacturerAfter comparison, we chose to cooperate. From sending samples to testing the goods, after a period of time, many merchants highly recognized the quality of our products and the efficiency of our services. There will be more opportunities for cooperation in the future. We mainly target the mid-to-high-end market and can customize solder and solutions according to the application scenarios of users.