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What is related to the pilling of solder paste? JJY Solder Paste Manufacturer answers for you
Return to List source: Release Date: 2021.01.14

    SMTThe solder paste used in the surface mount process isSolder paste manufacturerA kind of raw material for welding wire produced, due toSMTThe use of patches increased, and thus they came into beingNew materials for electric welding. The pilling of solder paste is caused by errors in the printing operation.JJY Solder Paste ManufacturerLet's inform our partners that the mysterious factors involved are as follows:

Lead-free solder paste305

    In the printing process, one issue is to stir when the temperature is insufficient. The second reason is that organic solvents are volatile and prone to evaporation. The third isSolder pasteFall onto the ink; The fourth is that when reflow soldering is used, the temperature rises rapidly, resulting in an overly fast boiling rate. The fifth point is that the environment is relatively humid and no drying treatment has been carried out. Sixth, the solder paste dries easily and the tin powder particles are much smaller. The seventh point is that solder paste exposed to the air is prone to oxidation, and incorrect operation of the scraper can cause solder balls.

    The overall situation is thatSMTThe solder paste manufacturers for printing should operate in accordance with the requirements and instructions to avoid accidents during operation. The brushing of solder paste is very important. A good solder paste can save a lot of trouble.

    For exampleJJY Industrial Technology Co., LTDThe solder paste comes in various specifications and can be developed with5GSynchronous circuit boardSMTSurface mount technology, lead-free tin wire for mobile phones and5GThe combination of wireless communication technology.

    In the electronics industry,Shenzhen JJY Industrial Technology Co., LTDFocusing on the combination of the soldering industry and the electronics industry, we have gone through many experiences12The company has been engaged in research and development and production for many years, including the production of solder paste, solder wire, solder wire, solder bar and leaded solder paste1In terms of research and development, JJY is a reliable solder paste manufacturer.

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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RQ-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:190±20Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle
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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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