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The factors causing solder paste to pill, let's share them together with JJY solder Paste Manufacturer
Return to List source: Release Date: 2021.01.31

    Solder paste isSMTOne of the more important solder materials in surface mount technology (SMT),Solder paste manufacturerThe solder paste, and it also followsSMTPatch is a new type of electronic soldering material that emerged in response to The Times. It is composed of solder powder,Flux pasteThe mixture of various substances such as surfactants and thixotropic agents generates sludge-like compounds.

The lead-free solder paste in the red bottle has no cap when viewed from above

    Key to useSMTFieldPCBSurface resistance, capacitorICElectronic soldering of electronic components, etc. ButSolder pasteDuring the entire printing process, incorrect operations can result in solder balls. So, what are the key reasons for the pilling of solder paste? JJY solder paste Manufacturer will answer for you:

    Before and after printing, the thawing time is too short, organic solvents are evaporated, and the solder paste turns into powder and falls onto the ink. The temperature of the soldering furnace is too high, causing violent boiling. The environmental humidity is too high and needs to be dehumidified. No solder bead prevention treatment is done. There are too many small particles. The solder paste is oxidized and absorbs moisture from the air. The heating is uneven. The scraping speed is too fast and the printing position is inaccurate, etc.

    Overall, the selection of solder paste is a rather important step. Choosing good solder paste and a solder paste distributor can reduce many of your troubles.

    Shenzhen JJYThe brand's solder paste has gone through many years12A solder paste and wire manufacturer specializing in the annual research and development of solder paste, solder wire, solder wire, lead-free solder paste, leaded solder paste, solder rods, leaded solder paste, etc.

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